Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec. Through the …