Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference
EDA 2023 Suite Includes 2.5/3DIC SI/PI Simulation for Advanced Packaging,3D EM Simulation, SI/PI and Multiphysics Analysis, High-Speed System Simulation Continuous Demonstrations This Week at Design Automation Conference in Booth #1435 SAN FRANCISCO, July …