Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak open-molded plastic packages (OmPP®) are RF- …