Tessolve Press Releases - EIN Presswire - Press Release Distribution Service

Published on July 27, 2026 - 14:00 GMT

Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology

SAN JOSE, CA, UNITED STATES, July 27, 2026 /⁨EINPresswire.com⁩/ -- Tessolve, a leading global provider of semiconductor systems and silicon solutions for next-generation products, today announced that they have collaborated with Intel Foundry to support …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on April 6, 2026 - 14:30 GMT

Tessolve Appoints Semiconductor Veteran Ravi Kumar Chirugudu as President & Chief Operating Officer

CALIFORNIA, CA, UNITED STATES, April 6, 2026 /⁨EINPresswire.com⁩/ -- Tessolve, a leading global provider of system and silicon solutions for next-generation products, today announced the appointment of Ravi Kumar Chirugudu as President & Chief …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on October 7, 2025 - 11:13 GMT

Tessolve Joins the eSync Alliance to Accelerate Connected Automotive Innovations

BANGALORE, KARNATAKA, INDIA, October 7, 2025 /⁨EINPresswire.com⁩/ -- Tessolve, a leading global provider of silicon to system engineering solutions for next-generation smart, intelligent, and connected products, has joined the eSync Alliance, a non-profit …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on September 1, 2025 - 12:50 GMT

Tessolve raises $150 million investment from TPG Inc.

The investment aligns with the company’s plan to expand its presence as a leading player in the global semiconductor industry. BANGALORE, KARNATAKA, INDIA, September 1, 2025 /⁨EINPresswire.com⁩/ -- Tessolve, a leading provider of semiconductor and …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on November 6, 2024 - 07:30 GMT

Hero Electronix’s Tessolve to Acquire Europe’s leading Chip Design Company for up to EUR 42.5 Million

This acquisition catapults Tessolve to the global elite in chip/ ASIC design. HANNOVER, GERMANY, November 6, 2024 /⁨EINPresswire.com⁩/ -- Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting-edge …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on September 10, 2024 - 06:56 GMT

Tessolve が TÜV SÜD から ISO 26262 - 自動車機能安全プロセス認証を取得

認証は Tessolve にとって重要な業界マイルストーンです TOKYO, JAPAN, September 9, 2024 /⁨EINPresswire.com⁩/ -- 次世代製品向けシステムおよびシリコンソリューションの大手グローバルプロバイダーである Tessolve は、認証機関 TÜV SÜD South Asia Private Limited から ISO 26262 機能安全プロセス認証を取得しました。この名誉ある認証は、高品質で安全に準拠したソリューションを提供するという …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on September 5, 2024 - 15:30 GMT

Tessolve receives ISO 26262 – Automotive Functional Safety Process Certification from TÜV SÜD

The certification marks a significant industry milestone for Tessolve. SAN JOSE, CA, UNITED STATES, September 5, 2024 /⁨EINPresswire.com⁩/ -- , Tessolve, a leading global provider of system and silicon solutions for next-generation products, received the …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on July 24, 2024 - 16:30 GMT

Tessolve Partners with SigmaSense to Develop their Innovative DSP-based Sensing ASIC

SAN JOSE, CALIFORNIA, USA, July 24, 2024 /⁨EINPresswire.com⁩/ -- Tessolve, a global provider of silicon and systems solutions for next-generation products has announced a strategic collaboration with SigmaSense to develop its innovative DSP-based sensing …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on May 29, 2024 - 11:43 GMT

TessolveとNXPは、二輪車の大衆市場向けデジタル・コネクテッド・クラスターの製品化を可能にします

技術提携二輪車および三輪車市場向けに、すぐに製造できるデジタル・コネクテッド・クラスター(DCC)プラットフォームを提供します。 TOKYO, TOKYO, JAPAN, May 29, 2024 /⁨EINPresswire.com⁩/ -- TessolveはNXPセミコンダクターズと協力して、NXPの i.MX RT1170クロスオーバーMCU、AW611 Wi-Fi/Bluetoothコンボチップ、KW45 Bluetooth LEスマートアクセスMCU、PF5103マルチチャネルPMIC …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on May 9, 2024 - 00:00 GMT

Tessolveは、産業、ロボット、輸送市場向けにRenesas RZ/V2H MPUを搭載したSMARCシステムモジュールを発表

テクノロジーの提携により、統合が可能なシステム・オン・モジュールとコンピュータ・ビジョン・システムのソリューションをOEMに提供し、製品実現のサイクルを合理化します。 TOKYO, JAPAN, May 9, 2024 /⁨EINPresswire.com⁩/ -- 次世代製品向けのシリコンおよびシステム・ソリューションの世界的プロバイダーであるTessolve は、ルネサスと協力し、ルネサスの高性能RZ/V2H MPUをベースとしたSMARCモジュールに新たな製品を導入し、ビジョンAI …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on May 2, 2024 - 14:36 GMT

Tessolve unveils SMARC system on module with Renesas RZ/V2H MPU for Industrial, Robotics & Transportation markets

Technology collaboration delivers ready-to-integrate system on module & computer vision system solutions for OEMs, streamlining product realization cycle. SAN JOSE, CALIFORNIA, USA, May 2, 2024 /⁨EINPresswire.com⁩/ -- Tessolve, a global provider of …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on April 9, 2024 - 15:36 GMT

Tessolve and NXP enable the Productization of Digital Connected Clusters for mass-market Two-Wheelers

Technology collaboration Delivers a ready-to-manufacture Digital Connected Cluster (DCC) platform for the 2-wheeler and 3-wheeler market. SAN JOSE, CALIFORNIA, USA, April 9, 2024 /⁨EINPresswire.com⁩/ -- Tessolve has collaborated with NXP® Semiconductors …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on February 28, 2024 - 09:21 GMT

Tessolve embarks on strategic collaboration with Keysight to accelerate time-to-market for high-speed designs

SAN JOSE , CALIFORNIA, USA, February 28, 2024 /⁨EINPresswire.com⁩/ -- Tessolve, a leading global provider of semiconductor engineering solutions, is pleased to announce a collaboration with Keysight Technologies to enable customers to drive semiconductor …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...

Published on August 17, 2023 - 01:30 GMT

Tessolve Joins Intel Foundry Services Accelerator Design Services Alliance to Supercharge Time to Market for Customers

SAN JOSE, CALIFORNIA, USA, August 17, 2023 /⁨EINPresswire.com⁩/ -- Tessolve, a leading global provider of semiconductor engineering solutions, announced today it has joined Intel Foundry Services (IFS) Accelerator Design Services Alliance. This …

Distribution channels: Automotive Industry, Aviation & Aerospace Industry ...