TUCSON, AZ, UNITED STATES, September 7, 2021 /EINPresswire.com/ -- The Keleher Research Group at Lewis University has signed a new six-month sponsored research agreement with Araca, Inc., an innovative company specializing in Chemical Mechanical Planarization (CMP). The collaboration will focus on the design of novel nano-dispersions and associated equipment for the CMP process that provide a tunable performance under externally energized conditions.

“Such an agreement will provide invaluable CMP experience for the research students, help strengthen the new generation of scientists entering our field, and, in turn, enhance the company’s technology and pathfinding efforts. It is truly a win-win,” said Dr. Ara Philipossian, president and CEO of Araca, Inc.
The work aims to further explore critical mechanisms that drive performance with particular emphasis on correlating laboratory-scale results to industrially relevant high-volume manufacturing processes.

“This partnership will provide world-class opportunities for our students while also laying the groundwork for countless 21st-century high-tech jobs here in the U.S.”, said Dr. Christopher White, dean of the Lewis University College of Aviation, Science, and Technology.

Araca Inc., headquartered in Tucson, Arizona, is a global provider of unique, enabling, and fully customized solutions for semiconductor device planarization applications. Visit www.aracainc.com for details.

Lewis University is an innovative and forward-thinking Catholic university offering market-relevant undergraduate and graduate programs to 6,300 students. Sponsored by the De La Salle Christian Brothers, Lewis University is nationally recognized for preparing intellectually engaged, ethically grounded, globally-connected, and socially responsible graduates. Visit www.lewisu.edu for further information.

Ara Philipossian
Araca, Inc.
+1 520-465-1419
email us here
Visit us on social media:
LinkedIn

Legal Disclaimer:

EIN Presswire provides this news content "as is" without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.