Chip Seal and Fog Seal Project to Begin on S.D. Highway 89
For Immediate Release: Tuesday, Aug. 24, 2021 Contact: Jay Noem, Project Manager, 605-440-1220
CUSTER, S.D. – The South Dakota Department of Transportation says crews will begin a chip seal and fog seal project on portions of S.D. Highway 89 starting Monday, Aug. 30, 2021. The project will begin at the intersection of U.S. Highway 385 in Pringle and head south for 15 miles.
Traffic will be reduced to one lane and guided through the project with the use of flaggers and a pilot car. Delays of up to 15 minutes can be expected while traveling through the work area during daytime hours. The contractor will be working weekdays only for the duration of the project.
Loose gravel will be present on the project for a period of 36 to 72 hours after each day’s chip seal application. Traffic is advised to travel 45 miles per hour or the posted speed limit if it is less than the advised speed during this timeframe. Permanent pavement striping is scheduled to be applied seven days after the chip seal on each project.
The prime contractor on the $1.7 million project is Asphalt Surface Technologies Corp. from St. Cloud, Minnesota. The completion date for the project will be Friday, Sept. 24, 2021.
About SDDOT:
The mission of the South Dakota Department of Transportation is to efficiently provide a safe and effective public transportation system.
For the latest on road and weather conditions, road closures, construction work zones, commercial vehicle restrictions, and traffic incidents, please visit https://sd511.org or dial 511.
Read more about the innovative work of the SDDOT at https://dot.sd.gov.
-30-
Legal Disclaimer:
EIN Presswire provides this news content "as is" without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.