CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Briefing
Credit: Andrew Kim
The CHIPS Research and Development Office’s vision for success of the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Subramanian Iyer, director of the NAPMP, will discuss current challenges in advanced packaging and the NAPMP’s vision for addressing them with investments in research and development.
You can view the recording and presentation from the webinar at https://www.nist.gov/chips/chips-america-webinars.
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