eSilicon to present on HBM/2.5D at SemIsrael Expo 2017
SAN JOSE, CA--(Marketwired - November 22, 2017) - eSilicon, an independent provider of FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions, will present Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions at …