Dublin, Feb. 09, 2018 (GLOBE NEWSWIRE) -- The "FLIR Boson - A Small, Innovative, Low Power, Smart Thermal Camera Core: Comparison and Cost Analysis" report has been added to ResearchAndMarkets.com's offering.

Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core's economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.

Key Topics Covered:

1. Overview/Introduction

2. Company Profile
Physical Analysis
Overview and Methodology
Package
Window
Microbolometer
ROIC
Comparison
Manufacturing Process Flow
Overview
ROIC Front-End Process and Wafer Fabrication Unit
Microbolometer Process Flow
Window Wafer Fabrication Unit
Packaging Process Flow

3. Cost Analysis
Summary of the Cost Analysis
Yield Explanation and Hypotheses
ROIC Front-End Cost
Microbolometer
Window
Component
Bonding front-end cost, IR sensor wafer and die cost, Back-end: final test cost and Microbolometer component cost
Estimated Price Analysis

For more information about this report visit https://www.researchandmarkets.com/research/f9sldp/flir_boson_smart?w=12

CONTACT: ResearchAndMarkets.com
         Laura Wood, Senior Manager
         press@researchandmarkets.com
         For E.S.T Office Hours Call 1-917-300-0470
         For U.S./CAN Toll Free Call 1-800-526-8630
         For GMT Office Hours Call +353-1-416-8900
         Related Topics: Optoelectronics 

Legal Disclaimer:

EIN Presswire provides this news content "as is" without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.