Silicon Genesis Corporation Press Releases

• Published on November 28, 2024 - 20:17 GMT

  

  Silicon Genesis Enhances 3DIC Integration with Breakthrough in NanoCleave™ Ultra-Thin Layer Transfer Technology

  NanoCleave™ enables transfer of 140nm ultra-thin silicon layers for cost-effective sustainable alternative to Temporary-Bond/Grind-Back/Layer-Release processes. FREMONT, CA, UNITED STATES, November 28, 2024 /⁨EINPresswire.com⁩/ -- – Silicon Genesis (SiGen …

  Distribution channels: Electronics Industry, IT Industry ...
• Published on February 29, 2024 - 08:00 GMT

  

  Silicon Genesis extends its NANOCLEAVE™ Layer Transfer Process for 3DIC Integration to Interconnect Network Layers

  Silicon Genesis continues to extend its NANOCLEAVE™ Layer Transfer Process Technology for 3DIC Integration Using Interconnect Network Layers (“INL”) FREMONT, CALIFORNIA, USA, February 29, 2024 /⁨EINPresswire.com⁩/ -- Silicon Genesis extends its …

  Distribution channels: Automotive Industry, Electronics Industry ...
• Published on December 9, 2023 - 15:54 GMT

  

  Silicon Genesis Broadens the Use of Layer Transfer Methods for Advanced CMOS Image Sensor Stacks

  Silicon Genesis has extended its NANOCLEAVE Layer Transfer (LT) methods for use in 3DIC device stacking to make high bandwidth CMOS Image Sensor (CIS) devices FREMONT, CALIFORNIA, UNITED STATES, December 9, 2023 /⁨EINPresswire.com⁩/ -- Silicon Genesis has …

  Distribution channels: Automotive Industry, Electronics Industry ...
• Published on August 31, 2023 - 08:37 GMT

  

  Silicon Genesis Extends Its NANOCLEAVE Layer Transfer Technology with New 3DIC Initiatives

  FREMONT, CALIFORNIA, USA, August 31, 2023 /⁨EINPresswire.com⁩/ -- Since introducing its pioneering NANOCLEAVE Layer Transfer Technology over twenty-years ago, SiGen has continued to develop and extend from historical applications such as Silicon-on …

  Distribution channels: Automotive Industry, Electronics Industry ...
• Published on March 3, 2023 - 02:00 GMT

  SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

  SiGen Extends Application of Industry Proven NanoTec Suite of Process Technology, Tools and Know-how, including NANOCLEAVE(TM) Layer Transfer Process, to 3DIC FREMONT, CA, UNITED STATES, March 2, 2023 /⁨EINPresswire.com⁩/ -- Silicon Genesis Corporation ( …

  Distribution channels: Automotive Industry, Electronics Industry ...
• Published on January 27, 2023 - 02:00 GMT

  SiGen Continues its Focus on Customer Specific 3DIC Applications Using NanoTec and NANOCLEAVE™ Layer Transfer Technology

  Since announcing 3DIC development over five years ago, the company has applied its layer transfer process and equipment technology to 3DIC applications. FREMONT, CALIFORNIA, USA, January 26, 2023 /⁨EINPresswire.com⁩/ -- Silicon Genesis continues its focus …

  Distribution channels: Automotive Industry, Electronics Industry ...