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eSilicon at DAC 2017: 2.5D/HBM2 FinFET ASIC & IP Solutions for High-Bandwidth Networking, Computing, AI and 5G Infrastructure
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eSilicon at DAC 2017: 2.5D/HBM2 FinFET ASIC & IP Solutions for High-Bandwidth Networking, Computing, AI and 5G Infrastructure
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