eSilicon at DAC 2017: 2.5D/HBM2 FinFET ASIC & IP Solutions for High-Bandwidth Networking, Computing, AI and 5G Infrastructure
SAN JOSE, CA--(Marketwired - June 13, 2017) - eSilicon, an independent provider of FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions, will participate at several venues at the 2017 Design Automation Conference (DAC) in Austin, Texas …