March 24, 2010 (FinancialWire) — Gennum Corp. (TSX: GND) said that its 6G IC solutions for SFP+ modules have been adopted for a large scale wireless backhaul build-out in China.

According to Genum, its products are used by wireless OEMs that are moving from third and fourth generation platforms to new platforms such as SFP+, which support data rates of six and 10 Gigabits/second.

Canada-based Gennum designs semiconductor solutions and intellectual property cores for consumer connectivity, enterprise, video broadcast and data communications products.

The firm has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, Taiwan, India and the United Kingdom.

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