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Intrinsyc® Technologies (TSX:ITC and OTC:ISYRF) Introduces System on Module and Development Kit for Next-Generation Wearables Based on Qualcomm Snapdragon Wear 2500 Platform

Ultra-small form factor (approx. 525mm2) Supports Features for Next-Gen Wearable Devices

VANCOUVER, B.C., June 27, 2018 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX:ITC) (OTC:ISYRF) (“Intrinsyc” or the “Company”), a leading provider of solutions for the development and production of embedded and Internet of Things (“IoT”) products; today announced the introduction of the Company’s Open‐Q™ 2500 System on Module (“SOM”)  and its companion Open‐Q™ 2500 Development Kit.  Intrinsyc’s Open-Q™ 2500 SOM is an ultra-small form-factor (approx. 525mm2) computing module based on the newly announced Qualcomm® Snapdragon Wear™ 2500 platform.  Intrinsyc’s Open-Q™ 2500 SOM combines critical elements for wearable device innovation and performance: high performance, small size, low power, integrated sensors, and seamless connectivity. The SOM is designed to meet the needs across a range of Android based wearable devices including pet, children, and elderly trackers, high-end fitness trackers, smartwatches, connected headsets, smart eyewear, and more.

The Snapdragon Wear™ 2500 platform that helps to power the Open-Q™ 2500 SOM is designed to facilitate thinner, sleeker product designs. An integrated, ultra-low power sensor hub supports rich algorithms with superior accuracy, is engineered to provide a cohesive picture of users and their environments. To help extend battery life for wearables, the Snapdragon Wear™ 2500 platform incorporates a new wearable PMIC and new GaAs PAs, which supports reduced power consumption both on standby and when active.

/EIN News/ -- Open-Q™ 2500 SOM Specifications:

Chipset Qualcomm® Snapdragon Wear™ 2500 Platform (APQ8009w/MSM8909w + PMW3100 + WGR7640/WTR2965 + WCN3620)
Memory / Storage ePoP 1GB LPDDR3 RAM + 8GB eMMC storage
Wireless Wi-Fi/BT using WCN3620 - 802.11b/g/n (2.4GHz), Bluetooth 4.1
Location GPS/GLONASS/Compass/Galileo using WGR7640 or WTR2965
Display 4-lane MIPI DSI - Up to 720p at 60fps optimized for wearables
Camera 2-lane MIPI CSI
Audio 2x I2S interfaces + DMIC input for digital audio peripherals
I/O USB2 with Type-C for quick-charge capability GPIO, BLSP, Sensor I/O, SDIO
OS Support Optimized Android for Wearables
Size Approx. 525mm2 (non-modem version), TBD (modem version)
Power Input 3.6V to 4.2V

Intrinsyc also offers a full-featured development platform including the software tools and accessories required to immediately begin development of wearable products and applications. The development kit marries the production-ready Open‐Q™ 2500 SOM with a carrier board providing numerous expansion and connectivity options to support the rapid development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible.  The Development Kit is available for pre-order at

A second version of the Open-Q™ 2500 SOM with integrated LTE modem is under development and availability will be announced in the third quarter of 2018.

“We are pleased to continue working closely with Qualcomm Technologies, Inc. to create go-to-market platforms for the wearable device segment,” stated Cliff Morton, Intrinsyc’s Vice President, Client Solutions. “Wearable device OEMs can utilize Intrinsyc’s development kit and production-ready Open-Q 2500 SOM, along with Intrinsyc’s comprehensive software, technical support, and design assistance services, to build their own wearable products, or they can engage with Intrinsyc for complete turnkey development.”

“The wearables segment is thriving, with unbridled innovation driving a desire by customers and developers for readymade SOM and development platforms to help them commercialize faster, “said Pankaj Kedia, Senior Director, Product Marketing, Qualcomm Technologies, Inc. “Working closely with Intrinsyc around the Snapdragon Wear 2100 platform has been highly successful, as evidenced by their announcement of their SOMs and developer kits based on Snapdragon Wear 2500, our next generation wearable platform for Android-based devices. The combination of the Qualcomm Technologies’ platform and Intrinsyc’s system level expertise can help customers to reduce development time for a variety of innovative new devices.”

From concept through production; Intrinsyc has the engineering expertise to make use of Qualcomm® Technologies’ platforms to achieve outstanding performance.  Contact Intrinsyc at with your product requirements and have one of the Company’s solution architects help plan for your successful product development and launch.

About Intrinsyc Technologies Corporation

Intrinsyc Technologies Corporation is a product development company that provides hardware, software, and engineering and production services that enable rapid commercialization of IoT products. Solutions span the development life cycle from concept to production and help device makers and technology suppliers create compelling differentiated products with faster time-to-market.   Intrinsyc’s Open-Q™ System on Modules incorporate the industry’s most advance Qualcomm® Snapdragon™ processor technology from Qualcomm® Technologies, Inc., and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market. Intrinsyc is publicly traded (TSX:ITC) (OTC:ISYRF) and is headquartered in Vancouver, BC, Canada, with additional engineering centers in Taipei, Taiwan, and Bangalore, India.

For more information, please contact:

Rachele Webb
Senior Marketing Communications Coordinator
Intrinsyc Technologies Corporation
Phone: +1-604-632-3559

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Qualcomm, Snapdragon and Snapdragon Wear are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon Wear and Qualcomm Snapdragon are products of Qualcomm Technologies, Inc. and/or its subsidiaries. 

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