Global Thermoset Molding Compound Market is Expected to Reach $13569.56 million By 2023

Market Research Report on Thermoset Molding Compound Market

Market Research Report on Thermoset Molding Compound Market

Thermoset Molding Compound Market Research Report

RAIPUR, INDIA, November 9, 2017 / --

Report Sellers has added a new market research report “Thermoset Molding Compound - Global Market Outlook (2017-2023)” to its offerings.

According to Report, the Global Thermoset Molding Compound market is estimated at $8356.56 million in 2016 and is expected to reach $13569.56 million by 2023 growing at a CAGR of 7.1% from 2016 to 2023.

Need for weight reduction & safety in transportation & aerospace, cost-effective substitute for heavy metals and ease in production of complex shapes are some key factors fueling the market. Moreover, increasing demand for these compounds from emerging economies provides huge growth opportunity for the market. However, instability in crude oil prices and regulatory challenges are hampering the market growth.

By Resin Type, polyester resin segment has high demand due to its property of outstanding flexibility and growing application in automotive body panel. Polyester resin offers excellent resistance to a wide range of chemicals at room temperature such as gasoline, aliphatic hydrocarbons, alcohols, and glycols. Asia Pacific held the largest market share. Countries such as China and India have become manufacturing hubs for several end-use industries in the recent past. Further, fast growth in urbanization, rising disposable income and increase in industrialization has a positive impact on the market. In addition, China is the largest consumer and supplier of the material and is expected to dominate the market during the forecast period as well.

Some of the key players in the market include Saudi Basic Industries Corporation (SABIC), Rogers Corporation, Plastics Engineering Company (Plenco), Kyocera Chemical Corporation, Kolon Industries Inc., Jiangsu Tianxin Chemical Co., Ltd, Huntsman Corporation, Hitachi Chemical Company Ltd., Hexion Inc., Evonik Industries AG, Eastman Chemical Company, Cosmic Plastics Inc., Chang Chun Plastics Co. Ltd., BASF SE and Ashland Global Holding Inc.

Browse through the complete description and in-depth TOC on “Thermoset Molding Compound Market”

What does the Report Offers

• Market share assessments for the regional and country level segments
• Market share analysis of the top industry players
• Strategic recommendations for the new entrants
• Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments

Report Scope

Global Thermoset Molding Compound market has been segmented by end user covered and regions covered

End Users Covered:
Electrical & Electronics
Other End Users
Resin Types Covered:
Polyester Resin
Melamine Formaldehyde Resin
Phenolic Resin
Urea Formaldehyde Resin
Epoxy Resin
Other Resin Types

Regions Covered:
North America
Rest of Europe
Asia Pacific
New Zealand
Rest of Asia Pacific
South America
Rest of South America
Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

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