/EINPresswire.com/ -- MILPITAS, CA--(Marketwired - June 06, 2016) - Open-Silicon, a system-optimized ASIC solution provider, today announced that it will present a technical paper and two posters, and demonstrate its breadth of ASIC solutions at the Design Automation Conference (DAC), June 6-8, 2016 in Austin, Texas.

Paper Presentation:

• Breaking Through "The Memory Wall" -- HBM IP Subsystem
  Tuesday June 7, 3:30pm - 5:00pm, Ballroom G (IP Track: Evolving IP Interconnects & Verification)

Poster Presentations:

• Physical Planning of I/O Interface for 3D Stacking of Packaged Devices
  Monday, June 6, 5:00pm - 6:00pm, Exhibit Floor (Design/IP Track Poster Session)

• Die Sizing Bound by Peripheral Bumps and IPs
  Tuesday, June 7, 5:00pm - 6:00pm, Exhibit Floor (Design/IP Track Poster Session)

Booth Demonstrations: #2431, Exhibit Floor

• IoT ASIC Platform - Demonstrates end-to-end communication between sensor hubs and a cloud platform through a gateway device. Depending upon the type of radio technology, the sensor hubs can be used outdoors, on the factory floor or inside a room. This Industrial IoT system setup is part of Open-Silicon's Spec2Chip IoT Platform, which allows IoT ASIC designs to be evaluated at the system level.
• 28G SerDes Evaluation Platform - Enables the rapid deployment of chips and systems for high-bandwidth networks. The platform includes a full board with packaged 28nm test chip, software and characterization data. The chip integrates a 28Gbps SerDes quad macro, using physical layer (PHY) IP and meets the compliance needs of the CEI-28G-VSR, CEI-25-LR and CEI-28G-SR specifications.
• HMC 2.0 Memory Controller ASIC IP Platform - Allows quick evaluation of the HMC technology and performance testing of the HMC links. Based on the Xilinx Virtex-7 FPGA, this platform includes a fully validated design that integrates an HMC controller exerciser functions.
• 2.5D SoC Solution Platform - Demonstrates a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded two dual core 1GHz ARM Cortex™-A9 ARM processors, connected across a 2.5D silicon interposer.
• Comprehensive HBM Gen2 IP Sub-system Solution - This solution is now available for 2.5D ASIC design starts and also as licensable Intellectual Property (IP). Open-Silicon's IP fully complies with the HBM-Gen2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die I/O needed to drive the interface between the logic-die and the memory die-stack on the 2.5D silicon interposer.

About Open-Silicon
Open-Silicon transforms idea into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design -- architecture, logic, physical, system, software, and IP -- and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing, and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed over 300 designs and shipped over 120 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.

Contact Information:

Purvi Shenoy
Open-Silicon
408-240-5772
Email contact


Media Contact:
Jennifer DeAnda
208-794-7113
Email contact

Legal Disclaimer:

EIN Presswire provides this news content "as is" without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.