Dublin, April 09, 2018 (GLOBE NEWSWIRE) -- The "Tronics GYPRO3300 Angular Rate Sensor Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

Tronics Microsystems, a leader in high-performance MEMS inertial sensors, recently released a new high-performance MEMS gyroscope specially designed for industrial and other demanding applications: the Tronics GYPRO3300. The GYPRO3300 is a next-generation MEMS angular rate sensor that can determine angle changes in three dimensions for applications such as 3D mapping, robotics, AHRS, and navigation systems.

Hermetically sealed in a single CLCC 30-pin package, and with a volume under 850 mm3, the GYPRO3300 can be integrated in many advanced systems.

The GYPRO3300 gyroscope is a unique, high-performance z-axis with a sleek structure that includes MEMS and ASIC in a ceramic package, using Tronics vacuum wafer-level packaging (WLP) technology based on micro-machined, thick single-crystal silicon. Resistant to moisture, dust, and dirt, the GYPRO3300 was designed for high-stress conditions.

The MEMS structure is based on a tuning-fork design working in anti-phase mode to reject external vibration. This structure is coupled with an ASIC specifically designed by Si-Ware for MEMS gyroscopes.

The GYPRO3300 offers a new level of performance, with a bias instability below 1/h and a vibration rectification of 0.002/s/g, which is qualified for industrial applications. Si-Ware's ASIC embeds OTP memory, a temperature sensor, and a phase-locked loop to manage, compensate, and process data issued from the MEMS. Moreover, the system works in a close-loop architecture that brings key advantages.

This report analyzes the complete component, including the package, MEMS, and ASIC dies developed by Tronics Microsystems-TDK. Moreover, this report provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used.

Also included is a complete cost analysis and selling price estimate for the GYPRO3300 z-axis gyroscope, as well as a comparison with two other high-end MEMS gyroscopes: Sensonor's STIM210 Multi-Axis and Analog Devices' ADIS16136.

Key Topics Covered:

1. Overview /Introduction

2. Tronics Microsystems - Company Profile

3. Physical Analysis
Physical Analysis Methodology
Sensor Package
View and dimensions
Package opening
Sensor package cross-section
MEMS Die
MEMS cap : View and dimensions
MEMS sensing area
MEMS die cross-section
ASIC Die
ASIC die view and dimensions
ASIC delayering and main blocs
ASIC die cross-section

4. Manufacturing Process Flow
ASIC Process Characteristics
ASIC Wafer Fabrication Unit
MEMS Front-End Process
MEMS Wafer Fabrication Unit

5. Cost Analysis
Cost Analysis Overview
Main Steps Used in the Economic Analysis
Yield Hypotheses
MEMS/ASIC Die Cost
Front-end (FE) cost
Back-end - tests and dicing
Wafer and die cost
Component
Packaging cost
Component cost

Companies Mentioned

• Sensonor
• Tronics Microsystems

For more information about this report visit https://www.researchandmarkets.com/research/dknrpm/complete_physical?w=12

CONTACT: ResearchAndMarkets.com
         Laura Wood, Senior Manager
         press@researchandmarkets.com
         For E.S.T Office Hours Call 1-917-300-0470
         For U.S./CAN Toll Free Call 1-800-526-8630
         For GMT Office Hours Call +353-1-416-8900
         Related Topics: Sensors 

Legal Disclaimer:

EIN Presswire provides this news content "as is" without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.