EIN Presswire: Semiconductors Live Feed Press Releases

Akros' Energy$ense™ Family Wins 2012 DesignVision Award

Wed, 08 Feb 2012 17:14:41 +0000

Akros' Energy$ense™ Family Wins 2012 DesignVision Award

PR Newswire

SUNNYVALE, Calif., Feb. 8, 2012 /PRNewswire/ -- Akros Silicon Inc., a premier supplier of leading-edge intelligent energy management ICs, today announced that its Energy$ense™ family of multi-output, digital DC/DC power management unit (DPMU) ICs has won the 2012 DesignVision Award in the "Semiconductor Components and ICs" category. The DesignCon technical committee, including 130 engineers and industry editors, evaluated products from hundreds of entries to choose the winners, who were recognized at an awards ceremony at DesignCon 2012 in Santa Clara, Calif.

(Logo: http://photos.prnewswire.com/prnh/20110309/LA62069LOGO)

The DesignVision Awards celebrate "the achievements of the most innovative electronics companies and the unique tools that support customer needs to improve and simplify the design process," says Patrick Mannion, Content Director, EDN & EE Times Designlines, for UBM Electronics. "Selection criteria included: industry vision, solution originality, and quality of implementation. "The industry-esteemed DesignVision awards honor the achievements of the most innovative semiconductor companies, the most prominent visionaries, and the most successful design tools in the industry. Reaching a final decision was difficult given the many excellent products submitted deserving of these awards."

"We are honored that our Energy$ense family was recognized with this prestigious award," said Parviz Ghaffaripour, Akros Silicon's President & CEO. "Akros developed the AS19xx Series of Energy$ense products to address the growing need for energy savings in modern platforms. Our innovative approach was to change the design paradigm from power management to 'total energy management.' Energy$ense products achieve our vision by delivering an energy-saving solution that is both practical and extremely cost-effective. We are delighted to receive this award as a validation of our efforts."

The 10 pin-compatible DPMUs comprising the AS19xx family come in different combinations of synchronous buck, boost and LED-drive converter configurations. Features include real-time power measurements and power-subsystem health monitoring, high efficiency (94% peak) and ultra-low standby current (<10uA), digital power control (via I2C) for selectable power operating modes, fast transient-handling capability for implementing adaptive power profiles, built-in spread-spectrum clocking for EMI management, and built-in sophisticated PWM-dimming for battery-draining LED-backlight displays.

Energy$ense DPMUs are suitable for a wide range of applications. These include 4G LTE residential gateways and femtocells, portable consumer products, NAS and media hubs, Internet-TV and IPTV set-top boxes, automotive infotainment systems, solid-state lighting, communication equipment with cluster-power or intermediate bus architectures, and many others.

For more information, please visit http://www.akrossilicon.com.

Tags: #Energy$ense, #EnergySense, #LEDDriver, #PMIC, #DPMU, #DCDC, #PowerManager, #PMU, #Akros Silicon, #Akros

About Akros Silicon

Headquartered in Silicon Valley, Akros Silicon provides leading edge, intelligent energy management ICs. Akros' disruptive silicon technology makes it possible to integrate multiple ICs, high-voltage isolation and discrete components into a single device, thus enabling electronic OEMs to develop cost-effective and energy-efficient solutions.

Media Contact
Greg Evans
WelComm, Inc.
858.633.1911
greg@welcomm.com

SOURCE Akros Silicon

Vishay Intertechnology to Highlight Latest Technologies in Seven Product Categories at IIC China 2012

Wed, 08 Feb 2012 16:00:00 +0000

Company to Showcase Industry-Leading Capacitors, Inductors, Resistors, Diodes, Power MOSFETs, Power ICs, and Optoelectronics

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing the company's latest industry-leading solutions at IIC China 2012, taking place from Feb. 23-25 in Hall 1 of the Shenzhen Convention and Exhibition Center. Coinciding with the company's 50th anniversary celebration -- work began at Vishay headquarters on Feb. 23, 1962 -- the IIC China show will provide a showcase for a wide range of technologies from Vishay in several product categories, including capacitors, inductors, resistors, diodes, power MOSFETs, power ICs, and optoelectronics in booth 1S11. In addition, from 3 p.m. to 3:20 p.m. on Feb. 23, Y.C. Yang, Vishay's director of Asia business development, will speak on the importance of proximity sensors in portable appliances.

IIC China is a must-attend event for design engineers, technical managers, and purchasing executives in China. It is China's largest showcase of IC application technologies and high-end components. Thousands of visitors gather at the show to learn about the latest electronics system design solutions from international vendors.

Vishay diodes on display at IIC China will include TMBS® Trench MOS Barrier Schottky rectifiers, and MicroSMP, SMP, and SMPC rectifiers and TVS. Vishay Siliconix will be highlighting its E Series power MOSFETs and p-channel devices with the industry's lowest on-resistance, in addition to multiplexers, integrated DrMOS power stages, and microBUCK® regulators.

Vishay will showcase a wide range of optoelectronic products, such as gate drivers, IR receivers for 3D active goggles, and proximity light sensors. Passive components will include aluminum and tantalum capacitors, low-profile, high-current inductors, and a wide range of resistors, including thin and thick film devices, Power Metal Strip® resistors, and much more.

At its booth, Vishay will also provide a demonstration comparing 1212-8 MOSFETs in the power MICRO FOOT® and PowerPAK® packages, in addition to demonstrations of its VCNL4000, VCNL4010, and VCNL4020 proximity ambient light sensors.

More information on IIC China 2012 is at http://www.english.iic-china.com/.

Vishay Intertechnology, Inc., a Fortune 1,000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay's product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

TMBS and Power Metal Strip are registered trademarks of Vishay Intertechnology. microBUCK, MICRO FOOT and PowerPAK are registered trademarks of Siliconix incorporated.

SMIC Reports Results for the Three Months Ended December 31, 2011

Wed, 08 Feb 2012 15:48:00 +0000

SMIC Reports Results for the Three Months Ended December 31, 2011

PR Newswire

SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION

(Incorporated in the Cayman Islands with limited liability)

(STOCK CODE: 0981)

SHANGHAI, Feb. 8, 2012 /PRNewswire-Asia/ --

-- Revenue down by 5.6% to $289.6million in 4Q11 from $306.9 million

in 3Q11 and down by 29.1% compared to 4Q10.

-- Gross margin was-7.4% in 4Q11 compared to 1.4% in 3Q11 primarily

due to revenue decrease, the increase of depreciation expenses and

theloss from the settlement with Elpida.

-- Net cash flow from operations decreased to $80.8 million in 4Q11

from $160.9 million in 3Q11mainly due to net losses.

-- Loss attributable to Semiconductor manufacturing International

Corporation was$165.6million in 4Q11, compared to loss of $88.1

million in 3Q11.

-- Diluted EPS was $(0.3) per ADS.

Set out below is a copy of the full text of the press release by the Company on February 8, 2012, in relation to its results for the three months ended December 31, 2011.

All currency figures stated in this report are in US Dollars unless stated otherwise.

The financial statement amounts in this report are determined in accordance with US GAAP.

Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended December 31, 2011.

First Quarter 2012 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

-- Revenue is expected to increase between 7% to 9%.

-- Gross margin is expected to range from 4% to 7%.

-- Operating expenses excluding foreign exchange differences are

expected to range from $96 million to $99 million.

-- Capital expenditure for the year of 2012 is expected to be

around $430 million

Dr. Tzu-Yin Chiu, Chief Executive Officer commented, "We are on track in implementing new initiatives and strategies within the company. Operationally, we continue to emphasize production improvement and customer service. As a result, more positive customer feedback is a testament to our strengthened team and improved performance and operations. In the fourth quarter of 2011, a leading customer ranked our Shanghai fab the number one 8-inch fab among all of its foundry suppliers. Another leading customer awarded us for our excellent track record of support for their power management processor after achieving over 1 billion unit shipments of power management processors with an outstanding delivery record over the past years."

"Our China revenue continues to grow along with China's semiconductor market. In 2011, our China fabless wafer revenue grew 16% compared to 2010, equivalent to 30.6% of our total wafer revenue in 2011."

"As for technology development, we are encouraged by our 45/40nm progress, with very positive feedback from our customers. Our 45/40nm service has become competitive with our peers. We have already begun early risk production, and 45/40nm contributed 0.3% of total revenue in the fourth quarter of 2011."

"With increased customer confidence and a recovering economy, we are seeing some rebound in the first quarter of this year, and we are targeting continued growth in the second quarter."

Conference Call / Webcast Announcement Date: February 9, 2012 Time: 8:30 a.m. Shanghai time Dial-in numbers and pass code:

US 1-866-519-4004 (Pass code: SMIC)

HK 8-0093-0346 (Pass code: SMIC)

China 80-0819-0121 (Pass code: SMIC)

The call will be webcast live with audio at http://www.smics.com/eng/investors/ir_presentations.php, or at http://www.media-server.com/m/p/9rse7p9s

An archived version of the webcast, along with an electronic copy of this news release will be available on the SMIC website for a period of 12 months following the webcast.

For a complete version of "SMIC Reports Results For The Three Months Ended December 31, 2011" including financial tables, please go to the following link: http://www.prnasia.com/sa/attachment/2012/02/20120208215705734570.pdf

About SMIC

Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility ("fab") and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab under construction in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.

For more information, please visit www.smics.com

Safe Harbor Statements (Under the Private Securities Litigation Reform Act of 1995)

This press release contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements under "First Quarter 2012 Guidance" are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward-looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, the downturn in the global economy and the impact on China's economy, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to capture growth opportunities in China, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, orders or judgments from pending litigation, availability of manufacturing capacity and financial stability in end markets.

Investors should consider the information contained in SMIC's filings with the U.S. Securities and Exchange Commission (SEC), including its annual report on 20-F filed with the SEC on June 28, 2011, especially in the "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" sections, and such other documents that SMIC may file with the SEC or The Hong Kong Stock Exchange Limited ("SEHK") from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on SMIC's future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated, or if no date is stated, as of the date of this press release. Except as required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.

SMIC Investor Relations

Tel: +86-21-3861-0000

Email: ir@smics.com

SOURCE　Semiconductor Manufacturing International Corporation

SMIC Reports Results for the Three Months Ended December 31, 2011

Wed, 08 Feb 2012 15:39:58 +0000

SMIC Reports Results for the Three Months Ended December 31, 2011

SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION

(Incorporated in the Cayman Islands with limited liability)

(STOCK CODE: 0981)

PR Newswire

SHANGHAI, Feb. 8, 2012 /PRNewswire-Asia/ --

Revenue down by 5.6% to $289.6 million in 4Q11 from $306.9 million in 3Q11 and down by 29.1% compared to 4Q10.
Gross margin was -7.4% in 4Q11 compared to 1.4% in 3Q11 primarily due to revenue decrease, the increase of depreciation expenses and the loss from the settlement with Elpida.
Net cash flow from operations decreased to $80.8 million in 4Q11 from $160.9 million in 3Q11 mainly due to net losses.
Loss attributable to Semiconductor manufacturing International Corporation was $165.6 million in 4Q11, compared to loss of $88.1 million in 3Q11.
Diluted EPS was $(0.3) per ADS.

Set out below is a copy of the full text of the press release by the Company on February 8, 2012, in relation to its results for the three months ended December 31, 2011.

All currency figures stated in this report are in US Dollars unless stated otherwise.

The financial statement amounts in this report are determined in accordance with US GAAP.

First Quarter 2012 Guidance:

Revenue is expected to increase between 7% to 9%.
Gross margin is expected to range from 4% to 7%.
Operating expenses excluding foreign exchange differences are expected to range from $96 million to $99 million.
Capital expenditure for the year of 2012 is expected to be around $430 million

"With increased customer confidence and a recovering economy, we are seeing some rebound in the first quarter of this year, and we are targeting continued growth in the second quarter."

Conference Call / Webcast Announcement

Date: February 9, 2012
Time: 8:30 a.m. Shanghai time
Dial-in numbers and pass code:

US	1-866-519-4004	(Pass code: SMIC)
HK	8-0093-0346	(Pass code: SMIC)
China	80-0819-0121	(Pass code: SMIC)

The call will be webcast live with audio at http://www.smics.com/eng/investors/ir_presentations.php, or at http://www.media-server.com/m/p/9rse7p9s

An archived version of the webcast, along with an electronic copy of this news release will be available on the SMIC website for a period of 12 months following the webcast.

About SMIC

For more information, please visit www.smics.com

Safe Harbor Statements

(Under the Private Securities Litigation Reform Act of 1995)

SMIC
Investor Relations
Tel: +86-21-3861-0000
Email: ir@smics.com

SOURCE Semiconductor Manufacturing International Corporation

Cadence President and Chief Executive Officer Lip-Bu Tan to Present at the Morgan Stanley Technology, Media & Telecom Conference

Wed, 08 Feb 2012 15:00:00 +0000

Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHO:
Lip-Bu Tan, president and chief executive officer, Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHAT:
Lip-Bu Tan will speak at the Morgan Stanley Technology, Media & Telecom Conference at the Palace Hotel in San Francisco. Tan will provide an overview of the company and participate in a question and answer session with analysts and investors.

WHEN:
Tan's address will be available live via on-demand webcast at 2:45 p.m. PST on Wednesday, Feb. 29, 2012. The presentation will be archived on the Cadence website and available for replay through 5 p.m. PST on Wednesday, March 28, 2012.

WHERE:
The webcast will be available online at: www.cadence.com/company/investor_relations/pages/default.aspx

For more information, please contact:
Therese Papenfuss
Investor Relations
Cadence Design Systems, Inc.
408-944-7100
investor_relations@cadence.com

STMicroelectronics Unveils World's First 3-Axis Gyroscope for Automotive Applications

Wed, 08 Feb 2012 14:38:58 +0000

STMicroelectronics Unveils World's First 3-Axis Gyroscope for Automotive Applications

The robust sensor aims to increase accuracy in car navigation and telematics systems

PR Newswire

GENEVA, Feb. 8, 2012 /PRNewswire/ -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of MEMS (Micro-Electro-Mechanical Systems) sensors and automotive ICs, has introduced the market's first 3-axis digital-output gyroscope that meets the industry-standard qualification for automotive integrated circuits (AEC-Q100). ST's newest angular-rate sensor aims to add positioning accuracy and stability to a wide range of automotive applications, including in-dash navigation, telematics and vehicle tolling systems.

Accurate measurements of angular-motion detection with ST's automotive-qualified gyroscopes will significantly enhance dead-reckoning and/or map-matching capabilities in car navigation and telematics applications. In situations when a GPS signal can't be seen, such as indoors and in urban canyons between tall buildings, dead-reckoning systems compensate for loss of satellite signal by monitoring motion, distance traveled and altitude. Precise gyroscope readings can also improve map-matching, the process of aligning a sequence of observed user positions with the road network on a digital map, used in a number of applications, including traffic flow analysis and driving directions.

These new dead-reckoning and map-matching capabilities are enabled with the industry-unique design concept of ST's gyroscopes, which employ a single sensing structure for motion measurement along all three orthogonal axes.(1) This eliminates any interference between the axes, significantly increasing measurement precision, coupled with excellent output stability over time and temperature.

ST's A3G4250D gyroscope measures angular rates up to +/-250dps (degree per second). An on-chip IC interface converts the angular-motion data into a 16-bit digital bit stream that is transmitted with high reliability to a dedicated microcontroller chip through a standard SPI or I(2)C protocol. The device provides two output lines (interrupt and data ready) and four user-selectable output data rates.

The 3V single-supply sensor integrates power-down and sleep modes and an embedded FIFO (first-in first-out) memory block for smarter power management. The A3G4250D embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85 degrees C. The device is robust to electromagnetic interference and withstands shocks up to 10,000g.

ST's 3-axis gyroscope for automotive applications has been designed and produced using the same manufacturing-process technology that ST has already successfully applied to 1.8 billion motion sensors sold in the market. ST customers benefit from the industry-unique combination of state-of-the-art product design and ST's capability to manage the whole supply chain, leveraging large-scale production capacity at the Company's dedicated 8-inch MEMS production lines.

Samples of ST's A3G4250D are available and volume production will start by Q2 2012. Unit pricing is $6 for volumes in the range of 1,000 pieces. Further pricing options are available for larger quantities.

(1) There are three main types of angular motion: yaw is rotation around the vertical axis; roll is rotation around the front-to-back axis and pitch is the rotation around the side-to-side axis.

Notes to Editors:

Established by the Automotive Electronics Council (AEC), AEC Q100 is an industry-standard specification that details a set of stress tests and defines the qualification requirements for integrated circuits in automotive applications.

About STMicroelectronics

STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2011, the Company's net revenues were $9.73 billion. Further information on ST can be found at www.st.com.

SOURCE STMicroelectronics

NI Technology Previews Earnings for TriQuint Semiconductor, Amtech Systems, Nuance Communications, NXP Semiconductors, and Cisco Systems

Wed, 08 Feb 2012 14:17:23 +0000

NI Technology Previews Earnings for TriQuint Semiconductor, Amtech Systems, Nuance Communications, NXP Semiconductors, and Cisco Systems

PR Newswire

PRINCETON, N.J., Feb. 8, 2012 /PRNewswire/ -- Next Inning Technology Research (http://www.nextinning.com), an online investment newsletter focused on semiconductor and technology stocks, has published in-depth earnings previews for TriQuint Semiconductor (Nasdaq: TQNT), Amtech Systems (Nasdaq: ASYS), Nuance Communications (Nasdaq: NUAN), NXP Semiconductors (Nasdaq: NXPI), and Cisco Systems (Nasdaq: CSCO).

Next Inning readers leverage the insight you can only get from an industry insider. Next Inning editor Paul McWilliams was a tech industry executive for more than two decades. Not only does he know how things work from the inside and how to spot a winning business model, he also has a long and successful record of picking winning stocks. Year-to-date in 2012 these picks have driven a 25% gain for the Next Inning Model Portfolio. Since its inception in 2002, the model portfolio is up over 300%.

Next Inning trial subscribers now have a rare opportunity to gain access to McWilliams' valuable insights including his expectations for companies scheduled to report earnings this week. In total, his earnings preview report provides commentary and outlooks for 13 leading tech companies. In addition to these, trial subscribers will also receive daily commentary covering headline events in the tech sector and McWilliams' insight into how to leverage them for profit.

https://www.nextinning.com/subscribe/index.php?refer=prn1359

McWilliams covers these topics and more in his recent reports:

-- TriQuint is up 48% from where it was trading in December when McWilliams called it one of his favorite stocks for 2012. Does he see further strength ahead for TriQuint that could push shares above $10 or has it reached McWilliams' price objective? What does McWilliams see as the drivers for TriQuint in 2012 and what will it take for the company to push its gross profit margin back above 40%?

-- When McWilliams suggested Next Inning subscribers consider buying Amtech in 2008 when it was trading for only $2.48, few investors had even heard of the stock. Following this he suggested taking profits or hedging with covered calls shortly after when Amtech was peaking at $30.80. Why has revenue fallen off at Amtech so significantly? What has changed in Amtech's operating structure and why is it important for investors to understand this change? Could the firm's upcoming earnings report generate a near-term rally? Is the stock well-positioned for long-term growth?

-- Apple's Siri voice-recognition feature has raised the profile of Nuance's technology, but what is the other secret to Siri's success that is totally unrelated to Nuance but that investors need to be aware of? Is Nuance now trading at a reasonable valuation, despite its leveraged balance sheet?

-- Is NXP continuing to demonstrate leadership in the emerging near-field communications (NFC) market? What three factors drove the decline in NXP's stock price in 2011? What is McWilliams' fair value range for NXP and how much upside does it represent? What red flag in the NXP equation should investors consider ahead of its earnings report?

-- In the fall of 2010, McWilliams advised Next Inning readers there was far too much collaboration and far too little action going on at Cisco. His prediction was Cisco needed to not only refocus, but substantially restructure. Cisco subsequently saw the light and did exactly that. The question now is will Cisco disappoint as Juniper did last month or will Cisco illustrate it is taking market share from not only Juniper, but also low-cost Chinese rivals, Huawei and ZTE? In his preview, McWillliams answers that and many more important questions about Cisco's strategy. In addition, he also dissects the value of Cisco's balance sheet and provides a detailed value model that projects the value of the stock in the three- to six-month horizon.

Founded in September 2002, Next Inning's model portfolio has returned 307% since its inception versus 49% for the S&P 500.

About Next Inning:

Next Inning is a subscription-based investment newsletter that provides regular coverage on more than 150 technology and semiconductor stocks. Subscribers receive intra-day analysis, commentary and recommendations, as well as access to monthly semiconductor sales analysis, regular Special Reports, and the Next Inning model portfolio. Editor Paul McWilliams is a 30+ year semiconductor industry veteran.

NOTE: This release was published by Indie Research Advisors, LLC, a registered investment advisor with CRD #131926. Interested parties may visit adviserinfo.sec.gov for additional information. Past performance does not guarantee future results. Investors should always research companies and securities before making any investments. Nothing herein should be construed as an offer or solicitation to buy or sell any security.

CONTACT: Marcia Martin, Next Inning Technology Research, +1-888-278-5515

SOURCE Indie Research Advisors, LLC

CyOptics Introduces Compact 40Gbps TOSA and ROSA for QSFP+ Transceivers

Wed, 08 Feb 2012 14:00:00 +0000

General Product Availability Set for July 2012

CyOptics Inc., a leader in Indium Phosphide (InP) and Silica on Silicon optical chip and component technologies, today announced the availability of a new series of 40Gbps transmit optical subassemblies (TOSA) and receive optical subassemblies (ROSA) for use in Quad Small Form Factor Pluggable (QSFP+) Transceivers targeting high-bandwidth routers and switches in datacenter and enterprise networks. The TOSA and ROSA expand CyOptics' growing portfolio of component solutions leveraging monolithic and hybrid Photonic Integrated Circuits (PICs).

The TPIC-10410-A1 TOSA delivers four Coarse Dense Wavelength Division Multiplexed (CWDM) wavelengths in the 1310nm window on a single optical output. The TOSA integrates four high reliability, high performance uncooled 10Gbps Directly Modulated Lasers (DMLs), an optical Multiplexer to combine the laser wavelengths, and four PIN photo-detectors for backfacet power monitoring. The RPIC-10410-A1 ROSA integrates an optical de-multiplexer to separate the four incoming CWDM wavelengths, an array of four high reliability, high performance 10Gbps PIN photo-detectors and a quad trans-impedance amplifier.

"Datacenter operators and equipment manufacturers don't have to worry about the interconnect flavor now that QSFP+ is available for both SR4 and LR4," said Ovum's Principal Analyst Karen Liu. "CyOptics' 40GE TOSA and ROSA enable this attractive high density form-factor for single-mode transceivers. We project 40G QSFP+ for LR4 applications to overtake CFP quickly, growing at a compounded annual growth rate of over 79% from 2012 through 2015; they represent one of the fastest growing market segments in the optical component space."

"Our new TOSA and ROSA address the needs for very compact 40GE QSFP+ solutions to provide higher faceplate density and lower power consumption in Datacenters," said Stefan Rochus, VP of Marketing and Business Development at CyOptics. "We are leveraging our extensive portfolio of high speed InP components together with our automated precision-robotic integration and packaging platforms to deliver these high performance and low cost 40Gbps TOSA and ROSA solutions."

The TOSA and ROSA are packaged in hermetic, planar packages with an LC receptacle optical interface and two flex connects for the electrical interface. The compact TOSA (15.8 mm length and 5.8 mm width) and ROSA (17.2 mm length and 5.8 mm width) packages are compliant for use in the QSFP+ transceiver form factor and serve the 40GBASE-LR4 (10km) application per IEEE 802.3ba standard. CyOptics is sampling the TPIC-10410-A1 and RPIC-10410-A1 now, with general availability planned for July 2012.

About CyOptics

Built by industry founders and leveraging its Bell Labs heritage, CyOptics has a unique set of optical device integration and manufacturing capabilities supporting its leadership position in the supply of sub-components to the optical communications and defense/aerospace markets. CyOptics is an industry leader in both hybrid integration using different elements in a single package and monolithic integration on a single chip. The Company's products are enabled by an automated "nano-tech" capable manufacturing process that delivers best performance, uniformity and cost. The Company's InP design, device fabrication and high performance packaging operations are located in Lehigh Valley, Pennsylvania; its Silica on Silicon PLC fab is located in South Plainfield, NJ; its planar automated packaging and testing operations are located in Matamoros, Mexico. CyOptics is ISO 9001:2008 certified. For more information, please visit http://www.cyoptics.com or call 1-484-397-2061.

Contact:
Ali Abouzari
CyOptics
484-397-2061

Fujitsu Enhances the FM3 Family of 32-bit ARM-Based Microcontrollers With the Release of 210 New Products

Wed, 08 Feb 2012 14:00:00 +0000

Fujitsu Enhances the FM3 Family of 32-bit ARM-Based Microcontrollers With the Release of 210 New Products

- Designed for a broad range of applications, from system controls to small mobile products -

PR Newswire

SUNNYVALE, Calif., Feb. 8, 2012 /PRNewswire/ -- Fujitsu Semiconductor America (FSA) today launched the fourth wave of products in its FM3 family of 32-bit RISC microcontrollers based on the ARM® Cortex™-M3 processor core. Fujitsu is releasing 210 new products. Incremental sampling started January 31.

The new products expand all four product groups that comprise the FM3 family – the High-Performance, Basic, Low Power, and Ultra-Low-Leak groups. With the addition of the new products, the FM3 family now includes 370 products. Fujitsu plans to continue expanding the product line to reach more than 500 products by the end of fiscal year 2012.

By group, the new products include the following:

High-Performance Group (MB9B510R/410/310/110 Series) – Fujitsu is adding 64 new devices to its High-Performance Group, including the MB9B510R/410/310/110 series and the MB9BF516RPMC. Devices in the High-Performance Group offer higher processing speeds and multi-functional versatility. The devices feature a 144MHz CPU, a full array of peripheral and communications functions (including USB 2.0 and CAN), a real-time clock, and inverter control functions able to control up to three motors. Products are available with 544KB or 160KB Flash memory and in 120-pin or 100-pin packages. This group is ideal for applications that require high-speed processing, including factory automation systems such as system controls, OA equipment, motor control, and inverter systems.

Basic Group (MB9A310K/110 Series) – The new MB9AF310K/110 series, the MB9AF312KMPC, and other products add 12 new devices to the Basic Group of the FM3 family. Devices in this group offer a balance between performance and cost, while still retaining the rich array of peripheral functions featured in the High Performance Group. The MB9A310K/110 series comes with inverter control functionality for single motor control, making these devices an optimal choice for applications such as factory automation systems and home appliances, including air conditioners and refrigerators requiring power conservation. Other features include USB 2.0, a real-time clock, and 160KB and 96KB Flash memory alternatives. The devices are available in 48-pin packages.

Low-Power Group (MB9AB40N/A40/340/140 Series) – Among the new products are the first offerings in the Low-Power Group, which adds support for both HDMI-CEC and LCD control. The 108 devices include the MB9AFB44NPMC and the MB9AB40N/A40/340/140 Series. The low-voltage operation of this product group helps reduce power consumption during operation and extend battery life. The devices, which are available in 288KB or 96KB Flash memory alternatives, come in 100-pin and 64-pin packages and include USB and a real-time clock. An LCD controller and HDMI-CEC make these MCUs optimal for a wide range of applications including home appliances with digital displays, AV applications that require AV equipment connections, battery-powered mobile products, and healthcare equipment that uses liquid crystal displays.

Ultra-Low-Leak Group (MB9AA30N/130 Series) –The 26 products in the Ultra-Low-Leak Group include the MB9AA30/130 series, and the MB9AFA32NPMC. This series inherits and refines the peripheral functions found in the High-Performance and Basic Groups, but offers dramatically lowered power requirements and reduced costs. This lineup of sensing models specializes in expanded intermittent operating capabilities. The MCUs are available in 100-pin and 64-pin packages and with 128KB or 64KB Flash memory configurations. The devices feature an LCD controller and a real-time clock. A wide voltage range of 5.5V to 1.8V makes these products well-suited for battery-powered applications including sensor networks, home electronics, and digital entertainment equipment.

"With the new products rounding out the FM3 Family, Fujitsu offers a complete lineup of ARM-based MCUs suitable for every application," said Akio Nezu, senior manager of marketing, Fujitsu Semiconductor America. "Our industry-leading High-Performance Group is designed for processor-intensive system controllers and application-oriented interfaces. The Basic Group is optimized to provide the most cost-effective single-motor inverter controls. The Low-Power Group meets the demand for energy-efficient consumer products. The Ultra-Low-Leak Group conserves energy in standby-power-constrained applications and in non-CPU performance-intensive applications."

For more information, visit http://us.fujitsu.com/semi/mcu/fm3.

About Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. (FSA) is a leading designer and developer of innovative semiconductor products and solutions for new generations of consumer, communications, automotive and industrial products. FSA provides a comprehensive portfolio of high-quality, reliable semiconductor products and services throughout North and South America. Founded in 1979 and headquartered in Sunnyvale, California, Fujitsu Semiconductor America (formerly Fujitsu Microelectronics America) is a wholly owned subsidiary of Fujitsu Semiconductor Limited (FSL), Japan.

For product information, visit the company's website at http://us.fujitsu.com/semi, e-mail FSA_inquiry@us.fujitsu.com or call 1-800-866-8608. For company news and updates, connect with FSA on Twitter at http://twitter.com/FujitsuSemiUS.

All product names mentioned herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and subject to change without advance notice.

SOURCE Fujitsu Semiconductor America, Inc.

Si-Ware Systems Launches U.S. Subsidiary, Adds Scott Smyser to Executive Team

Wed, 08 Feb 2012 14:00:00 +0000

Si-Ware Systems Launches U.S. Subsidiary, Adds Scott Smyser to Executive Team

PR Newswire

LOS ANGELES, Feb. 8, 2012 /PRNewswire/ -- Si-Ware Systems (SWS), a premier provider of IC- and MEMS-based solutions for industrial and consumer applications, announced it has launched a U.S. subsidiary, Si-Ware Systems, Inc. Additionally, the Cairo, Egypt-based company has appointed industry veteran Scott Smyser as executive vice president, responsible for overseeing worldwide marketing and business development as well as managing the U.S. subsidiary.

The expansions of operations is part of SWS's strategy to deliver a line of advanced devices to key markets as it expands its offering beyond design services and into standard products . SWS has developed three distinct product businesses – ASIC solutions, offering configurable ASICs for MEMS based components such as sensors and resonators; timing products, providing revolutionary all-silicon clock oscillator products; and MEMS solutions, including the unique SiMOST™ platform for single-chip optical systems.

Smyser has a broad range of experience in the semiconductor industry as an executive and strategy consultant for companies focused on timing devices, MEMS sensors and wireless technologies. He has led and advised various companies in the industry with an emphasis on marketing, technology, and product development. Most recently, Smyser was vice president & general manager for VTI Technologies, Inc. a leading supplier of MEMS sensors to the automotive, medical, and consumer markets. He also co-founded VTI's timing device business.

"The continuing growth of ever-smaller "smart" devices requires higher levels of integration and miniaturization," said Scott Smyser, executive vice president and general manager, Si-Ware Systems, Inc. "Si-Ware's innovative design platforms and its expertise in integrating MEMS and ASICs make them an ideal provider for new cutting-edge solutions."

"Si-Ware has focused its design services efforts in growth areas – MEMS sensors are increasingly used across multiple industries, silicon timing devices are cost-effective alternatives to quartz, and there is a continued drive to miniaturize optical systems," said Hisham Haddara, Ph.D, CEO at Si-Ware Systems. "We have been able to leverage our design expertise to create highly integrated new products that can be easily incorporated into larger systems. Establishing a subsidiary in the U.S. and bringing Scott on to manage global business development is the next logical step in consolidating our growth plan for these strategic products."

About Si-Ware Systems

Si-Ware Systems is an independent fabless semiconductor company providing a wide spectrum of product design and development solutions, custom ASIC development and supply as well as standard products.

The company leverages its highly talented teams in MEMS (micro electromechanical systems) design and development as well as analog/mixed-signal and radio frequency integrated circuits (RFICs) to provide highly innovative solutions and products in different areas ranging from PLL-based timing circuits, sensor interfaces, frequency synthesis, data converters, RF front ends, and MEMS-based sensor systems. For more information, please visit www.si-ware.com.

Contacts:
Tom Breunig
Cleantech Concepts (for Si-Ware Systems, Inc.)
+1 503 858 2801
tbreunig@cleantechconcepts.com

Scott Smyser, EVP, W/W Marketing & Business Development
Si-Ware Systems, Inc.
Tel.: +1 818 259 2785
scott.smyser@si-ware.com

SOURCE Si-Ware Systems

World's Fastest 10GbE Converged Network Adapters from Broadcom Earn Another Major Industry Certification - VMware vSphere® 5

Wed, 08 Feb 2012 13:05:00 +0000

World's Fastest 10GbE Converged Network Adapters from Broadcom Earn Another Major Industry Certification - VMware vSphere® 5

10GbE Converged Network Adapters Deliver Complete Storage Solution for Enterprise Server Virtualization

PR Newswire

IRVINE, Calif., Feb. 8, 2012 /PRNewswire/ --

News Highlights:

Broadcom Converged Network Adapters (CNAs) address growing demand for virtualization in data centers
CNAs deliver fully certified storage solution for VMware vSphere 5
World's fastest FCoE performance – 80 percent faster than nearest competitor(1)

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that its converged network adapters (CNAs) have earned FCoE (Fiber Channel over Ethernet) certification on VMware vSphere 5. Following other recent certifications – EMC E‑Lab and NetApp validation – VMware vSphere 5 marks another major industry certification milestone in Broadcom's expanding 10GbE storage and networking ecosystem. Visit http://www.broadcom.com to learn more.

Demand for server virtualization continues to rise as IT managers strive to maximize efficiency of servers, increase security, and ensure higher levels of automated performance. International Data Corporation (IDC) forecasts more than 70 percent of all server workloads installed on new shipments in 2014 will reside in a virtual machine.(2)

vSphere 5 is the latest version of VMware's virtualization platform for small- and mid-size businesses, as well as enterprise-class users. VMware vSphere 5 delivers better application performance and availability for business-critical applications while automating the management of an increasingly broad pool of data center resources. VMware's certification confirms Broadcom's CNAs offer full interoperability within vSphere 5 environments.

Industry Leading Performance
Broadcom CNAs deliver FCoE performance speeds of up to 1.7 million input/output operations per second (IOPS) – more than 80 percent faster than the nearest competitor(1), optimizing virtualization by uniting data and storage networks on a common 10GbE fabric. By taking advantage of switch-independent NIC partitioning, Broadcom's FCoE solution allows the server to adapt to a broad range of bandwidth configurations and reduce power and cooling costs while minimizing overall system complexity. In addition to FCoE offload, it features multiprotocol support including Level 2 (L2) networking, Network Attached Storage (NAS), and Internet Small Computer System Interface (iSCSI).

Quotes:

Parag Patel, Vice President, Alliances, VMware
"Broadcom's converged network adapters meet VMware's certification requirements for running business-critical applications. This certification underscores the long-standing relationship between Broadcom and VMware, bringing significant value to our mutual customers. VMware vSphere accelerates the journey to the cloud for existing data centers while underpinning compatible public cloud offerings that pave the way to the hybrid cloud."

Benjamin Woo, VP Storage and Big Data, International Data Corporation
"Server virtualization is the 'killer app' for the datacenter and has forever changed IT operations. Virtualization customers are rapidly deploying converged hardware as a means to lower time to deployment and to simplify an increasingly complex datacenter infrastructure. This certification of Broadcom's 10GbE CNA is an important milestone because it ensures full interoperability with one of the industry's most popular virtualization environments."

Vinod Lakhani, General Manager, High Speed Controllers, Broadcom Corporation
"Server virtualization, cloud computing, and the need to contain costs and complexity are all major factors driving the need for 10GbE converged network adapters (CNAs). Broadcom is meeting that demand with the world's fastest CNAs and is proud that its fully offloaded FCoE solutions have earned VMware's vSphere 5 certification. This validation underscores Broadcom's growing ecosystem of solution partners."

Resources:

(1) Demartek (based on Broadcom's ~1.7 million IOPS compared to Emulex's 919,268 IOPS in OCe10102)
(2) International Data Corporation
(3) Broadcom BCM97712-T Dual-Port 10GBASE-T Adapter
(4) VMware vSphere 5

Subscribe to RSS Feed:
Broadcom Infrastructure & Networking Group
http://go.broadcom.com/sv2

About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.

Contacts
Press	Investors
John Jatinen	Chris Zegarelli
Manager, Public Relations	Director, Investor Relations
949-926-3462	949-926-7567
john.jatinen@broadcom.com	czegarel@broadcom.com

SOURCE Broadcom Corporation; BRCM Infrastructure & Networking

Methodics Announces Support for Latest Release of Subversion Version Control System to Enable More Efficient IC Design

Wed, 08 Feb 2012 13:00:00 +0000

Version 1.7 of Popular CM Tool Brings More Performance and Enhances Distributed Use Model for Large IC Design Projects

Methodics, Inc., the leading provider of integrated solutions used in managing design data and semiconductor intellectual property (IP) for complex IC design, today announced that its suite of SoC development tools supports the latest release of the popular Subversion® version control system. The integration provides development teams with an efficient way to manage the hardware and software aspects of large, complex ICs. The Subversion 1.7 release, developed by the Subversion open-source community, is the most complete ever and includes a number of performance improvements, enhancements to both the client and server features, and changes that improve a distributed use model.

The Methodics suite of design data and IP management tools work synergistically with the Subversion platform to manage how a wide range of design data is used, tracked, debugged and archived. The integration of release 1.7 further allows IC designers to fully exploit the features and capabilities of Subversion to see faster and more efficient results for collaborative design methodologies.

"There is a large base of users of the Methodics SoC DM solution that also uses Subversion. The improvements in the latest release of Subversion will make the methodology that the tools enable together to operate even more efficiently, both from a performance standpoint as well as in how disparate design teams can collaborate on projects," Simon Butler, CEO of Methodics, said. "SoC design is becoming increasingly more like a software development process, and the combination of Methodics' expertise in IC design and Subversion's track record of improving software development results in a solution ideally suited for today's highly integrated SoCs."

New features, better performance in Subversion 1.7

HTTPv2 - a new HTTP protocol variant designed to enhance performance between Subversion clients and the server
A new in-memory caching system for FSFS repository backends
A range of features that improve its ability to show "diffs," including a new option that is similar to git
Network compression - a protocol for avoiding CPU bottlenecks on the compression side
Working copy meta-data cached in a client-side SQLlite database

The modular Methodics architecture allows the addition of tools for managing the design data in a variety of ways, creating a sophisticated collaborative work environment that meets the growing need for communication between multiple sites and design teams, and enables visual comparison and implementation of design changes. Using such industry-standard tools as Subversion 1.7 as the configuration management (CM) database ensures that design data is never locked into a proprietary system, and also makes the entire CM companion tools ecosystem available to facilitate user-specific IP and release methodologies.

About Methodics, Inc.
Methodics, Inc. is a leading provider of design data management (DM) tools that improve the efficiency and collaboration of integrated circuit (IC) design. Its IP Developer™ and SoC Integrator™ systems are components in the first integrated platform for managing SoC realization, reducing the time, complexity and costs involved in IP-based design approaches. Its VersIC™ DM tools integrate industry-standard software configuration management tools, such as the Perforce® and Subversion® version control systems into the hardware design environment to provide a more efficient global collaboration experience. The privately held company has offices in the USA, Europe and Asia. For further information, visit www.methodics.com.

For more information, contact:
Mike Williams
(415) 354-5726
Email Contact

Mike Sottak
(408) 876-4418
Email Contact

City of Tulsa Installs High Quality, Energy Efficient LED Street Lighting in Historic Brady District

Wed, 08 Feb 2012 13:00:00 +0000

Amerlux and Bridgelux Enable New Street Lighting Solutions

Tulsa, Oklahoma, known for most of the 20th Century as the Oil Capital of the World, is now leading the way with new energy efficient alternatives. Thanks to a highly successful collaboration between the City of Tulsa, U.S.-based luminaire manufacturer, Amerlux, and U.S.-based lightsource manufacturer, Bridgelux, modern, energy-efficient LED lighting are part of the restoration of Tulsa's historic Brady district. About 200 Amerlux outdoor luminaires based on Bridgelux LED arrays are planned to illuminate the walkways around the new Driller Stadium and park. Sixty-four were installed in 2011 with the remaining street lights slated for installation this year. The new LED lighting is anticipated, in the long run, to save the City of Tulsa thousands of dollars in reduced energy and maintenance costs, compared to the conventional High Intensity Discharge (HID) streetlights used in other areas of the city.

"The collaboration between the City and its lighting manufacturer and supplier delivered a flexible, energy- and cost-efficient solution that significantly improved the quality and longevity of Tulsa's outdoor lighting," said Paul Strizek, planning and contracts manager for the City of Tulsa. "Together we delivered on the City's commitment to reduce our energy use, increase sustainability and offer our citizens a better quality of light."

Featuring industry-leading Bridgelux ES LED arrays, the Amerlux D142 and D154 Series decorative downlight allows for a variety of optical configurations, enabling the systems to be optimized for a customer's unique needs such as application requirements and light output. This helps to ensure that light levels and light quality meet the application requirements for a particular environment. Moreover, the Amerlux D142 and D154 downlights deliver large lumen packages of up to 7600 and 5000 lumens respectively, making it an ideal replacement for HID luminaires.

LED street lighting is an optimal solution for municipalities across the country, delivering immediate savings from lower energy costs and reduced maintenance costs. Further, high quality LED lighting increases the visibility and visual attraction of storefronts, restaurants and other hospitality and commercial environments, as demonstrated in the white paper published by LED Roadway Lighting1.

1 "Incorporating Spectrum Effects for Brightness Perception and Visual Detection at Mesopic Light Levels"; Samuel M. Berman, PhD and Jack Josefowicz, PhD.

About Bridgelux
Bridgelux is a leading developer and manufacturer of technologies and solutions transforming the $40 billion global lighting industry into a $100 billion market opportunity. Based in Livermore, California, Bridgelux is a pioneer in solid-state lighting (SSL), expanding the market for light-emitting diode (LED) technologies by driving down the cost of LED lighting systems. Bridgelux's patented light source technology replaces traditional technologies (such as incandescent, halogen, fluorescent and high intensity discharge lighting) with integrated, solid-state lighting solutions that enable lamp and luminaire manufacturers to provide high performance and energy-efficient white light for the rapidly growing interior and exterior lighting markets, including street lights, commercial lighting and consumer applications. With more than 600 patent applications filed or granted worldwide, Bridgelux is the only vertically integrated LED manufacturer and developer of solid-state light sources that designs its solutions specifically for the lighting industry. For more information about the company, please visit www.bridgelux.com

About Amerlux LLC
Amerlux speaks the language of light for design and construction professionals around the world by manufacturing a broad array of optically superior, energy efficient lighting solutions for the retail, supermarket, hospitality, commercial and outdoor lighting markets. Amerlux products and services include track lighting, recessed downlighting and multiples, pendants, linear fluorescents, and custom lighting systems, as well as support for energy reduction plans that can be used as a guide to state, city and local utility rebate programs for maximum energy savings and utility incentives. The company's domestic and international clients receive the support of Amerlux's highly trained specification sales force, as well as expert service from initial design to on-time delivery made possible by strategically located manufacturing, warehousing and shipping locations.

Contact:
Brian Fisher
Bridgelux, Inc.
Phone: 925.583.8563
E-mail: brianfisher@bridgelux.com

EZchip Announces Fourth Quarter and Full Year 2011 Results

Wed, 08 Feb 2012 13:00:00 +0000

EZchip Announces Fourth Quarter and Full Year 2011 Results

PR Newswire

YOKNEAM, Israel, February 8, 2012 /PRNewswire/ --

EZchip Semiconductor Ltd. (NASDAQ: EZCH), a leader in Ethernet network processors, today announced its results for the fourth quarter and full year ended December 31, 2011.

Fourth Quarter and Full Year 2011 Highlights:

Annual revenues for 2011 of $63.5 million
Fourth quarter revenues of $14.3 million
Fourth quarter gross margin was 6.6% on a GAAP basis, including a one-time charge due to early repayment of $9.9 million to the Israeli Office of Chief Scientist (OCS)
Fourth quarter gross margin on a non-GAAP basis reached 76.8%
Net income of $7.9 million, on a GAAP basis, for 2011 and net loss of $6.0 million for the fourth quarter (including a one-time charge due to early repayment of $9.9 million to the OCS)
Net income was $31.0 million, on a non-GAAP basis, for 2011 (49% of revenues) and $6.3 million for the fourth quarter (44% of revenues)
Non-GAAP operating cash flow of $9.0 million for the quarter and $28.8 million for 2011
End of 2011 net cash was $126.8 million

Fourth Quarter 2011 Results:

Total revenues in the fourth quarter of 2011 were $14.3 million, a decrease of 17% compared to $17.1 million in the fourth quarter of 2010, and a decrease of 24% compared to $18.7 million in the third quarter of 2011.

Net loss, on a GAAPbasis, for the fourth quarter of 2011 was $6.0 million, which includes a one-time charge due to early repayment of $9.9 million to the Israeli Office of Chief Scientist (OCS), or $0.22 per share, compared to net income of $4.0 million, or $0.15 per share (diluted), in the fourth quarter of 2010, and net income of $7.7 million, or $0.27 per share (diluted), in the third quarter of 2011.

Net income, on a non-GAAP basis, for the fourth quarter of 2011 was $6.3 million, or $0.22 per share (diluted), compared to non-GAAP net income of $8.6 million, or $0.31 per share (diluted), in the fourth quarter of 2010, and non-GAAP net income of $9.9 million, or $0.35 per share (diluted), in the third quarter of 2011.

Cash, cash equivalents and marketable securities as of December 31, 2011, totaled $126.8 million, compared to $127.6 million as of September 30, 2011. Cash generated from operations during the fourth quarter was $9.0 million, cash used in investing activities was $0.6 million, cash provided by financing activities (resulting from the exercise of options) was $0.7 million and additional $9.9 million used for the repayment of OCS grants.

Full Year 2011 Results

Total revenues for the year ended December 31, 2011 were $63.5 million, a year-over-year increase of 2% compared to $62.0 million in 2010.

Net income on a GAAP basis for 2011 was $7.9 million, or $0.28 per share (diluted), compared to net income of $13.6 million, or $0.52 per share (diluted), in 2010.

Net income on a non-GAAP basis for 2011was $31.0 million or $1.09 per share (diluted), compared with non-GAAP net income of $30.4 million, or $1.14 per share (diluted), in 2010.

Repayment of OCS Grants

During December 2011 we made a one-time early payment of $9.9 million to the Israeli Office of Chief Scientist, representing the full balance of the contingent liability related to the NP-4 and NPA grants received. Upon making this payment, we have eliminated all future royalty obligations related to our anticipated NP-4 and NPA revenues and saved the associated future interest payments related to such obligations.

Eli Fruchter, CEO of EZchip, commented, "2011 was a transition year for EZchip: a transition to Cisco as our largest customer, to NP-3 as our largest revenue generator and to NP-4 becoming our fastest growing product ever, accounting for 21% of 2011 revenues with over 90% related to sample shipments. NP-5 is well along in its development cycle and leading tier-1 customers have selected to continue the EZchip path with the NP-5. We believe that substantially all NP-4 customers will select the NP-5 for their next generation platforms. We are making good progress with our new product development in Kiryat Gat and we believe that we are building an extremely competitive, strongly differentiated product that will open a new market for EZchip and more than double our total addressable market. On the financial side in 2011, excluding our largest NP-2 customer (which declined 40% year over year), EZchip's revenues grew over 30% in a challenging year with global economy worries. We were also able to grow our gross margin and net income during the year.

"Looking ahead, we believe that the NP-4 can significantly increase our revenues in the coming years based on more platform wins, higher ASP and the forecasted demand. In the shorter term, we expect continued growth in 2012, mainly in the second half of the year when all NP-4 based systems are likely to be in production and when carriers are expected to resume strong investments in Internet infrastructure."

Conference Call

The Company will be hosting a conference call later today, February 8, 2012, at 10:00am ET, 7:00am PT, 3:00pm UK time and 5:00pm Israel time. On the call, management will review and discuss the results, and will be available to answer investor questions.

To participate through the live webcast, please access the investor relations section of the Company's web site at: http://www.ezchip.com/investor_relations.htm, at least 10 minutes before the conference call commences. If you would like to ask a question on the call, please contact the investor relations team for the telephone dial in numbers.

For those unable to listen to the live webcast, a replay of the webcast will be available the day after the call under the 'Investor Relations' section of the website.

Use of Non-GAAP Financial Information

In addition to disclosing financial results calculated in accordance with United States generally accepted accounting principles (GAAP), this release of operating results also contains non-GAAP financial measures, which EZchip believes are the principal indicators of the operating and financial performance of its business. The non-GAAP financial measures exclude the effects of stock-based compensation expenses recorded in accordance with FASB ASC 718, amortization of intangible assets, one-time charge due to early repayment of OCS grants and taxes on income. Management believes the non-GAAP financial measures provided are useful to investors' understanding and assessment of the Company's on-going core operations and prospects for the future, as the charges eliminated are not part of the day-to-day business or reflective of the core operational activities of the Company. Management uses these non-GAAP financial measures as a basis for strategic decisions, forecasting future results and evaluating the Company's current performance. However, such measures should not be considered in isolation or as substitutes for results prepared in accordance with GAAP. Reconciliation of the non-GAAP measures to the most comparable GAAP measures are provided in the schedules attached to this release.

About EZchip

EZchip is a fabless semiconductor company that provides Ethernet network processors for networking equipment. EZchip provides its customers with solutions that scale from 1-Gigabit to 200-Gigabits per second with a common architecture and software across all products. EZchip's network processors provide the flexibility and integration that enable triple-play data, voice and video services in systems that make up the new Carrier Ethernet networks. Flexibility and integration make EZchip's solutions ideal for building systems for a wide range of applications in telecom networks, enterprise backbones and data centers. For more information on our company, visit the web site at http://www.ezchip.com.

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Forward-looking statements are statements that are not historical facts and may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. These statements are only predictions based on EZchip's current expectations and projections about future events. There are important factors that could cause EZchip's actual results, level of activity, performance or achievements to differ materially from the results, level of activity, performance or achievements expressed or implied by the forward-looking statements. Those factors include, but are not limited to, the impact of general economic conditions, competitive products, product demand and market acceptance risks, customer order cancellations, reliance on key strategic alliances, fluctuations in operating results, delays in development of highly-complex products and other factors indicated in EZchip's filings with the Securities and Exchange Commission (SEC). For more details, refer to EZchip's SEC filings and the amendments thereto, including its Annual Report on Form 20-F filed on March 31, 2011, as amended on September 27, 2011, and its Current Reports on Form 6-K. EZchip undertakes no obligation to update forward-looking statements to reflect subsequent occurring events or circumstances, or to changes in our expectations, except as may be required by law.

EZchip Semiconductor Ltd.

Condensed Consolidated Statements of Operations

(U.S. Dollars in thousands, except per share amounts)

(Unaudited)

------------

 
                              Three Months Ended              Twelve Months Ended
                     --------------------------------------  -----------------------
                     December     September      December    December      December
                        31,           30,           31,         31,           31,
                       2011          2011          2010        2011          2010
                     ----------   ----------     ----------  ----------   ----------
 
    Revenues          $ 14,269      $ 18,703      $ 17,136    $ 63,457      $ 61,998
    Cost of
    revenues             3,386         4,509         4,461      14,409        15,668
    Amortization
    of purchased
    technology              --            --           453         597         1,915
    Repayment of
    OCS grants           9,938            --            --       9,938            --
                     ----------   ----------     ----------  ----------   ----------
    Gross profit           945        14,194        12,222      38,513        44,415
 
    Operating
    expenses:
    Research and
    development, net     4,352         4,052         3,577      16,695        13,665
    Selling,
    general and
    administrative       3,097         2,956         2,617      12,059        10,001
                     ----------   ----------     ----------  ----------   ----------
    Total
    operating                                                
    expenses             7,449         7,008         6,194      28,754        23,666 

                     ----------   ----------     ----------  ----------   ----------
    Operating    
    income (loss)       (6,504)        7,186         6,028       9,759        20,749
    Financial
    income, net            551           467           312       1,713         1,130
                     ----------   ----------     ----------  ----------   ----------
    Income (loss)
    before taxes       (5,953)         7,653         6,340      11,472        21,879
 
    Taxes on         
    income                  --            (3)       (2,314)     (3,530)       (8,236)
    Net income       ----------   -----------    ----------  ----------   -----------
    (loss)           $ (5,953)       $ 7,650       $ 4,026     $ 7,942      $ 13,643
                     ==========   ===========    ==========  ==========   ===========
 
    Net income
    (loss) per
    share:
    Basic             $ (0.22)        $ 0.28        $ 0.16      $ 0.30        $ 0.54
    Diluted           $ (0.22)        $ 0.27        $ 0.15      $ 0.28        $ 0.52

    Weighted
    average shares
    used in per
    share calculation:
         
    Basic           27,015,478    26,900,439    25,877,546  26,681,749    25,281,651
           
    Diluted         27,015,478    28,046,688    27,130,392  28,001,428    26,110,132

                    ----------   ----------     ----------  ----------   -----------

EZchip Semiconductor Ltd.

Reconciliation of GAAP to Non-GAAP Measures

(U.S. Dollars in thousands, except per share amounts)

(Unaudited)

                              Three Months Ended              Twelve Months Ended
                     --------------------------------------  -----------------------                                                        
                      December     September      December    December      December
                         31,           30,           31,         31,           31,
                        2011          2011          2010        2011          2010
                     ----------   ----------     ----------  ----------   ----------
 
    GAAP gross
    profit               $ 945      $ 14,194      $ 12,222    $ 38,513      $ 44,415
    Stock-based
    compensation            73            73           133         359           302
    Amortization
    of purchased
    technology              --            --           453         597         1,915
    Repayment of
    OCS grants*          9,938            --            --       9,938            --
 
    Non-GAAP gross   ----------   ----------     ----------  ----------   ----------
    profit            $ 10,956      $ 14,267      $ 12,808    $ 49,407      $ 46,632
                     ----------   ----------     ----------  ----------   ----------
 
    GAAP gross
    profit as
    percentage of
    revenues              6.6%         75.9%         71.3%       60.7%         71.6%
                     ----------   ----------     ----------  ----------   ----------
    Non-GAAP gross
    profit as
    percentage of
    revenues             76.8%         76.3%         74.7%       77.9%         75.2%
                     ----------   ----------     ----------  ----------   ----------
 
    GAAP operating
    expenses           $ 7,449       $ 7,008       $ 6,194    $ 28,754      $ 23,666
    Stock-based
    compensation:
      Research and
      development       (1,094)       (1,107)         (782)     (4,446)       (2,941)
      Selling,
      general and
      administrative    (1,051)       (1,012)         (717)     (3,801)       (2,587)
    Amortization
    of intangible
    assets
      Selling,
      general and
      administrative       (95)          (95)         (193)       (380)         (773)
 
    Non-GAAP
    operating        ----------   ----------     ----------  ----------   ----------
    expenses           $ 5,209       $ 4,794       $ 4,502    $ 20,127      $ 17,365
                     ----------   ----------     ----------  ----------   ----------
 
    GAAP operating
    income (loss)    $ (6,504)       $ 7,186       $ 6,028     $ 9,759      $ 20,749
 
    Non-GAAP
    operating        ----------   ----------     ----------  ----------   ----------
    income             $ 5,747       $ 9,473       $ 8,306    $ 29,280      $ 29,267
                     ----------   ----------     ----------  ----------   ----------


    GAAP net
    income (loss)    $ (5,953)       $ 7,650       $ 4,026     $ 7,942      $ 13,643
    Stock-based
    compensation         2,218         2,192         1,632       8,606         5,830
    Amortization
    of purchased
    intangible
    assets                  95            95           646         977         2,688
    Repayment of
    OCS grants*          9,938            --            --       9,938            --
    Taxes on
    income**                --             3         2,314       3,530         8,236
 
    Non-GAAP net     ----------   ----------     ----------  ----------   ----------
    income             $ 6,298       $ 9,940       $ 8,618    $ 30,993      $ 30,397
                     ----------   ----------     ----------  ----------   ----------
    Non-GAAP net
    income per
    share - Diluted     $ 0.22        $ 0.35        $ 0.31      $ 1.09        $ 1.14
    Non-GAAP
    weighted
    average shares                                          
    - Diluted***    28,605,559    28,577,753    27,596,018  28,432,175    26,616,453

* During December 2011 we made a one-time early payment of $9.9 million to the Israeli Office of Chief Scientist, representing the full balance of the contingent liability related to the NP-4 and NPA grants received. Upon making this payment, we have eliminated all future royalty obligations related to our anticipated NP-4 and NPA revenues and saved the associated future interest payments related to such obligations. This amount was excluded from the non-GAAP statements of operations as it represents future royalty obligations.

** Taxes on income represent the non-cash utilization of a deferred tax asset with respect to the Company's estimate of its accumulated taxable income in accordance with FASB ASC 740. During 2011, EZchip Technologies, the Company's main subsidiary completed the utilization of the deferred tax asset, and started to enjoy the ten year period of exemption from Israeli corporate taxes due to benefits provided pursuant to its Israeli approved and privileged enterprise programs.

*** In calculating diluted non-GAAP net income per share, the diluted weighted average number of shares outstanding excludes the effects of stock-based compensation expenses in accordance with FASB ASC 718.

EZchip Semiconductor Ltd.

Condensed Consolidated Balance Sheet

(U.S. Dollars in thousands)

                                                December 31,     December 31,
                                                    2011             2010
                                                ------------     ------------
                                                (Unaudited)       (Audited)
    ASSETS
    CURRENT ASSETS:
    Cash, cash equivalents and marketable
    securities                                     $ 126,770        $ 101,310
    Trade receivables, net                             8,655            8,988
    Other receivables                                  1,837            1,178
    Inventories                                        5,788            4,522
    Deferred tax assets, net                              --            3,443
                                                ------------     ------------
    Total current assets                             143,050          119,441
 
    NON CURRENT ASSETS:
    Severance pay fund                                 5,215            5,209
    Long term investment and others                      337              335
                                                ------------     ------------
    Total non current assets                           5,552            5,544
 
    PROPERTY AND EQUIPMENT, NET                          828              419
 
    Goodwill                                          96,276           96,276
    Intangible assets, net                             1,205            1,181

                                                ------------     ------------    
    TOTAL ASSETS                                   $ 246,911        $ 222,861
                                                ============     ============
 
    LIABILITIES AND SHAREHOLDERS' EQUITY
    CURRENT LIABILITIES:
    Trade payables                                   $ 2,319          $ 1,289
    Other payables and accrued expenses                6,352            6,569
                                                ------------     ------------
    Total current liabilities                          8,671            7,858
 
    LONG TERM LIABILITIES:
    Accrued severance pay                              6,081            5,974
 
    SHAREHOLDERS' EQUITY:
    Share capital                                        155              149
    Additional paid-in capital                       288,641          271,959
    Accumulated other comprehensive income
    (loss)                                              (960)             540
    Accumulated deficit                              (55,677)         (63,619)
                                                ------------     ------------
    Total shareholders' equity                       232,159          209,029
                                                ------------     ------------
 
    TOTAL LIABILITIES AND SHAREHOLDERS'
    EQUITY                                         $ 246,911        $ 222,861
                                                ============     ============

EZchip Semiconductor Ltd.

Selected Condensed Consolidated Cash Flow Data on a Non-GAAP basis

(U.S. Dollars in thousands)

(Unaudited)

                                                             Twelve Months
                              Three Months Ended                 Ended
                       ---------------------------------- --------------------
                       December    September    December  December    December
                          31,          30,         31,       31,         31,
                         2011         2011        2010      2011        2010
                       --------    ---------    --------  --------    --------
    Cash flows from
    operating
    activities:
                              
    Net income (loss)  $ (5,953)     $ 7,650     $ 4,026   $ 7,942    $ 13,643
    Adjustments to
    reconcile net
    income (loss) to
    net cash provided
    by operating
    activities:
    Repayment of OCS
    grants*               9,938           --          --     9,938          --
    Depreciation and
    amortization            163          162         696     1,227       2,887
    Decrease
    (increase) in
    trade and other
    receivables, net      1,113       (2,100)     (1,677)     (621)      2,133
    Decrease
    (increase) in
    inventory               259          (87)       (913)   (1,266)     (2,989)
    Decrease in
    deferred tax
    asset                    --           --       2,303     3,513       8,162
    Increase
    (decrease) in
    trade payables
    and other accrued
    liabilities, net      1,213       (1,996)       (608)     (494)     (4,077)
    Stock-based
    compensation          2,218        2,192       1,632     8,606       5,830
                        --------    ---------    --------  --------    --------
    Net cash provided
    by operating
    activities            8,951        5,821       5,459    28,845      25,589
                        --------    ---------    --------  --------    --------
 
    Cash flows from
    investing
    activities:
    Purchase of
    property and
    equipment               (97)        (138)        (74)     (411)       (385)
    Purchase of
    technology             (500)          --          --      (500)         --
    Cash paid for
    investment in
    affiliated
    Company                  --           --          --        --        (200)
                        --------    ---------    --------  --------    --------
    Net cash used in
    investing
    activities             (597)        (138)        (74)     (911)       (585)
                        --------    ---------    --------  --------    --------
 
    Cash flows from
    financing
    activities:
    Proceeds from
    issuance of share
    capital                  --           --          --        --       1,072
    Proceeds from
    exercise of
    options                 711        1,466       2,890     8,082       7,988
                        --------    ---------    --------  --------    --------
    Net cash provided
    by financing
    activities              711        1,466       2,890     8,082       9,060
                        --------    ---------    --------  --------    --------
 
    Repayment of OCS
    grants*              (9,938)          --          --    (9,938)         --
    Unrealized gain
    (loss) on
    marketable
    securities, net           6         (542)        (99)     (618)          8
                        --------    ---------    --------  --------    --------
 
    Increase
    (decrease) in
    cash, cash
    equivalents and
    marketable
    securities             (867)       6,607       8,176    25,460      34,072
    Cash, cash
    equivalents and
    marketable
    securities at the
    beginning of the
    period              127,637      121,030      93,134   101,310      67,238
                        --------    ---------    --------  --------    --------
    Cash, cash
    equivalents and
    marketable
    securities at the         
    end of the period  $126,770     $127,637    $101,310  $126,770    $101,310
                       =========    =========   ========= =========   =========

* During December 2011 we made a one-time early payment of $9.9 million to the Israeli Office of Chief Scientist, representing the full balance of the contingent liability related to the NP-4 and NPA grants received. Upon making this payment, we have eliminated all future royalty obligations related to our anticipated NP-4 and NPA revenues and saved the associated future interest payments related to such obligations. This amount was excluded from the non-GAAP operating cash flow as it represents future royalty obligations.

Contact:
Ehud Helft / Kenny Green
CCG Investor Relations
ezchip@ccgisrael.com
Tel: (US) +1-646-201-9246

SOURCE EZchip Semiconductor Ltd

Microsemi to Present at the Goldman Sachs Technology and Internet Conference 2012

Wed, 08 Feb 2012 12:00:00 +0000

Microsemi to Present at the Goldman Sachs Technology and Internet Conference 2012

PR Newswire

ALISO VIEJO, Calif.—, Feb. 8, 2012 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will present at the Goldman Sachs Technology and Internet Conference 2012 at the Palace Hotel in San Francisco, Calif. Feb. 15, 2012 at 2 p.m. PST.

(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)

Those unable to attend in person can listen to a live audio webcast of this presentation on Microsemi's website at www.microsemi.com. The webcast will be hosted on the site until April 15, 2012.

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and medical, alternative energy and industrial markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF ICs, ultra low-power radios, customizable SoCs, FPGAs and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.

SOURCE Microsemi Corporation