EIN Presswire: Nanotechnology Live Feed Press Releases

AMD Announces Departure of Emilio Ghilardi as Senior Vice President and Chief Sales Officer

Tue, 07 Feb 2012 21:05:00 +0000

AMD President and CEO Rory Read to Serve as Interim Chief Sales Officer

AMD (NYSE: AMD) today announced the departure of Emilio Ghilardi as senior vice president and chief sales officer, effective immediately. Rory Read, AMD president and chief executive officer, will serve as interim chief sales officer while the company actively seeks a replacement.

"I'd like to thank Emilio for his contributions to the business and wish him well in his future endeavors," said Read. "Developing relationships with our customers that are grounded in a foundation of trust through consistently delivering on our commitments is critical, and we are making progress toward that goal. AMD enters 2012 with significant momentum, and we are building upon that momentum by embracing the shifts occurring in the industry and marrying market needs with innovative technologies to become a consistent growth engine."
Mr. Ghilardi joined AMD from Hewlett Packard in 2008.

About AMD
AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its groundbreaking AMD Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD's server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD's superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.

AMD, the AMD Arrow logo, AMD Opteron, Radeon and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Contact:
Mike Silverman
AMD Global Communications
512-602-3781
Email Contact

Ruth Cotter
AMD Investor Relations
408-749-3887
Email Contact

SynQor and Lineage Power Settle IBA Patent Litigation

Tue, 07 Feb 2012 19:00:00 +0000

SynQor, Inc. announced today that it has entered into a definitive Settlement Agreement with Lineage Power Corp. to resolve SynQor's IBA patent litigation against Lineage (SynQor, Inc. v. Artesyn Technologies, Inc., et al., Civil Action No. 2:07-CV-497, U.S. District Court Eastern District of Texas). Terms of the settlement are confidential.

In this suit SynQor asserted 5 patents against 11 of the largest industry suppliers of unregulated and semi-regulated bus converters, including Lineage Power Corp. In a unanimous verdict, a federal jury found that each of the 11 defendants infringed one or more of SynQor's patents and upheld the validity of all such patents and awarded SynQor collective damages in excess of $95 million. The Court later awarded SynQor more than $19M in additional compensation, bringing the total to more than $114M.

In January 2011, the Court issued a Permanent Injunction against each of the defendants in the suit, including Lineage Power, enjoining them from manufacturing and selling infringing products.

In October 2011, SynQor filed a second complaint against Lineage Power and the other defendants in Civil Action No. 2:11-CV-444, U.S. District Court Eastern District of Texas, directed at additional infringing sales after the Permanent Injunction was entered. Also that month, Lineage Power and the other defendants filed notices of appeal. Pursuant to the terms of the Settlement Agreement, Lineage Power has agreed to dismiss its appeal. Lineage Power has also agreed to comply with the Permanent Injunction, which precludes it from selling unregulated and semi-regulated bus converters to customers in the United States and from inducing its customers to sell products into the United States that contain Lineage's unregulated and semi-regulated bus converters.

Dr. Martin F. Schlecht, President and CEO of SynQor, commented: "We are pleased to reach this agreement with Lineage relating to our IBA patents. We look forward to continuing to work with our customers to implement the important IBA power architecture in their telecommunications, network, storage, military, industrial and other applications."

Inquiries concerning the foregoing should be directed to Arthur R. Hofmann, Jr., SynQor's Executive Vice President and General Counsel.

For information please visit http://www.synqor.com/ or contact your local SynQor representative.
Email: Inquiries@SynQor.com

SynQor, Inc.
155 Swanson Rd.
Boxborough, MA 01719
PH: 978-849-0600

NanoInk Announces Launch of Contract Services Program for Live Single Cell Assay Work

Tue, 07 Feb 2012 16:11:00 +0000

Service Offering Expected to Advance Research Programs Involved With Toxicity Assessment, High Content Screening, and Cell-Cell Communication

NanoInk's® NanoFabrication Systems Division announced today that it introduced a new contract services program dedicated to the development of live single cell array assays. This offering supplements NanoInk's portfolio of Dip Pen Nanolithography® (DPN®)-based systems and tools used for micro and nanopatterning applications to include a service component. Life scientists now have even more ways to access the advantages of DPN for their research.

At the heart of the NanoFabrication Systems' contract services program is its DPN nanofabrication instruments capable of constructing complex multiplexed patterns of biocompatible materials at sub-cellular scales. This capability can be utilized to construct defined microenvironments for attaching live single cells and subsequently investigating cellular responses. Single cells (up to 5,000 individual cells on a single NanoInk chip) can be exposed to different external stimuli (including biological, chemical and topographical stimuli) and the downstream effects of these stimuli can be monitored at the cellular, proteomic or genomic levels. Additionally, studies on limited or rare cells harvested from a patient can potentially be exposed to many conditions, making theranostic applications possible. This new contract services program will enable researchers to engage NanoInk to design, develop and construct custom single cell assays.

"We believe that NanoInk's single cell assay technology has the potential to revolutionize in vitro cell biology research, including applications in drug toxicity testing and drug screening. Micropatterned single cells can also be harnessed to probe underlying mechanisms of cell behavior like cell-cell interactions, cell-surface interactions, cell migration, and cell invasion," explained Tom Warwick, general manager of the NanoFabrication Systems Division.

NanoInk has already demonstrated the ability of its nanofabrication platform to place single cells at defined locations on a substrate and to then expose individual cells to small molecules and nanoparticles.

Saju Nettikadan, Ph.D., director of applications development at NanoInk, said, "NanoInk findings also show that two different cell types can be placed at defined locations on a single chip to form single cell co-cultures. We have demonstrated the single cell co-culture proof-of-concept using 3T3 fibroblasts and C2C12 myoblasts. As part of our live single cell assay contract research program, we welcome requests to design and develop custom assays."

NanoInk's NanoFabrication Systems Division brings sophisticated nanofabrication to the laboratory desktop in an easy to use and affordable setting. For more information on nanofabrication instruments and tools, as well as the new single cell assay contract services program, please contact Tom Warwick at twarwick@nanoink.net, (847)679-NANO (6266) or visit www.nanoink.net/divisions.html#NanoFabrication.

About NanoInk
NanoInk, Inc. is an emerging growth technology company specializing in nanometer-scale manufacturing and applications development for the life sciences, engineering, pharmaceutical, and education industries. Using Dip Pen Nanolithography® (DPN®), a patented and proprietary nanofabrication technology, scientists are enabled to rapidly and easily create micro-and nanoscale structures from a variety of materials on a range of substrates. This low cost, easy to use and scalable technique brings sophisticated nanofabrication to the laboratory desktop. Headquartered in the Illinois Science + Technology Park, north of Chicago, NanoInk currently has several divisions including the NanoFabrication Systems Division, the Nano BioDiscovery Division, the NanoProfessor™ Division and the NanoGuardian™ Division. For more information on products and services offered by NanoInk, Inc., visit www.nanoink.net.

NanoInk, the NanoInk logo, Dip Pen Nanolithography, and DPN are registered trademarks of NanoInk, Inc.

Contacts:

Joshua Taustein
Dresner Corporate Services
(312)780-7219
jtaustein@dresnerco.com

David Gutierrez
Dresner Corporate Services
(312)780-7204
dgutierrez@dresnerco.com

eSilicon Expands SerDes IP Licensing Agreement With Avago Technologies

Tue, 07 Feb 2012 13:45:00 +0000

Broad-Based Access to 28nm-90nm SerDes Cores for eSilicon Customers

eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), announced today that eSilicon has expanded its existing agreement with Avago Technologies to include access to Avago's 28nm, 40nm, 65nm and 90nm embedded SerDes cores. The agreement allows eSilicon to offer these high-performance cores and related IP as part of its custom chip development solution, positioning it to address the growing communications and storage ASIC markets. The SerDes cores support a broad range of popular industry standards such as PCI-Express, Fibre Channel, CEI, 10GBASE-KX/KX4/KR, FCoE, GigE, XAUI, and XFI/SFI and are suitable for both chip-to-chip and backplane applications. Avago Technologies has a long legacy of embedded SerDes technology leadership and has shipped more than 200 million SerDes channels. The SerDes cores offer very low jitter, making it possible to integrate many SerDes channels on a single chip.

"SerDes technology is clearly an area where Avago excels, and we are pleased to offer our customers access to an expanded SerDes IP portfolio and related IP bundle," said Patrick Soheili, VP marketing, eSilicon. "Avago's IP, combined with eSilicon's design, productization and manufacturing operations expertise and our foundry partner TSMC's manufacturing expertise provides our customers with a proven way to get a high-performance product to market quickly."

"Avago's IP engagement with eSilicon now spans four process generations," said Frank Ostojic, VP and GM of Avago Technologies' ASIC Products Division. "Our expanded agreement will allow eSilicon to serve a broader range of customers with high-performance, low-power requirements in process nodes ranging from 90nm down to 28nm."

Avago's SerDes cores are based on a modular, multi-rate architecture allowing hundreds of SerDes channels to be easily integrated on a single chip. The SerDes cores include a unique decision feedback equalization (DFE) feature resulting in a number of key performance differentiators such as low overall power, best-in-class data latency, and best-in-class jitter and crosstalk tolerance.

The Avago SerDes cores and the related IP bundle are available immediately to eSilicon customers. For more information, please visit eSilicon's website or contact an eSilicon sales representative in your area.

About Value Chain Producers
A value chain producer (VCP) is a company that collaborates with foundries, IP and service providers, EDA suppliers, package, assembly and test operations in designing and producing chips for fabless IC, IDM and OEM companies. VCPs optimize the economics of customer value chains and enable customers to focus on their product differentiation and market growth.

About eSilicon
eSilicon, the largest independent semiconductor VCP, delivers ASICs to OEMs and fabless semiconductor companies through a fast, flexible, lower-risk path to volume production by deploying its comprehensive suite of design-through-manufacturing services and custom IP offerings. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com

eSilicon -- Enabling Your Silicon Success™

eSilicon is a registered trademark, and the eSilicon logo and Enabling Your Silicon Success are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

For more information:

eSilicon Media Contact:
Susan Cain
Cain Communications
(503) 538-2747
Email Contact

Sally Slemons
eSilicon Corporation
(408) 616-4695
Email Contact

EVE Named Event Sponsor of SemIsrael Verification Day February 14 in Tel Aviv

Tue, 07 Feb 2012 13:30:00 +0000

ZeBu Emulation Platform's Enhanced Debugging Capabilities to Be Highlighted

WHO:
EVE, the leader in hardware/software co-verification

WHAT:
Will exhibit at SemIsrael Verification Day, the largest and most focused event for the Silicon Verification sector

WHEN:
Tuesday, February 14, from 8:45 a.m.-3 p.m.

Where:
Green House, Tel Aviv, Israel

SemIsrael attendees will have an opportunity to learn about EVE's new ZeBu-Blade2 hardware-assisted verification platform, the first member of the ZeBu emulation family based on Xilinx Virtex6-LX760 field programmable gate arrays (FPGAs). The desktop emulator supports full-chip application specific integrated circuit (ASIC) and system-on-chip (SoC) designs of up to 32-million ASIC gates, and offers fast execution and attractive pricing for best-in-class hardware/software integration ahead of silicon availability.

For more information on EVE and its hardware/software co-verification platforms, visit: www.eve-team.com.

The SemIsrael Verification Day website can be found at: http://www.semisrael.com/component/option,com_fabrik/Itemid,240/fabrik,12/random,0/view,form/

About EVE

EVE is the worldwide leader in hardware/software co-verification solutions, offering fast transaction-based co-emulation and in-circuit emulation, with installations at five of the top six semiconductor companies. EVE products shorten the overall verification cycle of complex integrated circuits and electronic systems designs. Its products can be integrated with transaction-level ESL tools and software debuggers, target hardware systems, as well as Verilog, SystemVerilog and VHDL simulators. EVE is a member of OCP-IP and ARM, Mentor Graphics, Real Intent, SpringSoft and Synopsys Partner programs. Follow EVE on Twitter at www.twitter.com/EVETEAM and on Facebook at: http://tiny.cc/hykzr. Its United States headquarters is in San Jose, Calif. Telephone: (408) 457-3200. Facsimile: (408) 457-3299. Corporate headquarters is in Palaiseau, France. Telephone: (33) 1 64.53.27.30. Fax: (33) 1 64.53.27.40. Email: info@eve-team.com. Website: www.eve-team.com.

EVE acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

For more information, contact:
Lauro Rizzatti
General Manager of EVE USA
(408) 457-3201
Email Contact

Nanette Collins
Public Relations for EVE
(617) 437-1822
Email Contact

Ingenic Licenses Arteris Chip-to-Chip (C2C) IP Solution for Mobile Application Processors

Tue, 07 Feb 2012 13:00:00 +0000

Chip-to-Chip (C2C) Interconnect Technology Enables Lower Bill of Materials (BOM) Cost and Smaller Printed Circuit Board (PCB) Area for Smartphone and Tablet Application Processors

Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that Ingenic Semiconductor Co., Ltd. has selected Arteris' Chip-to-Chip (C2C) interconnect solutions for Ingenic's mobile phone and tablet application processor systems-on-chip (SoCs). Ingenic chose Arteris interconnect IP to support the high speed inter-chip communication requirements in their next generation XBurst mobile SoC products.

Silicon-proven C2C IP from Arteris enables high bandwidth, low-latency inter-chip communication. This allows two chips, such as a mobile phone applications processor and a mobile phone modem, to share a single random access memory (RAM) chip. The round-trip latency of the inter-chip connection is fast enough for the modem baseband to share the application processor's RAM chip and to maintain enough read throughput and low latency for cache refills. This enables the phone manufacturer to remove the modem baseband's dedicated RAM chip from the phone's bill of materials (BOM), saving a minimum $2 in cost per phone.

In addition to the $2 cost savings, removing a RAM saves significant printed circuit board (PCB) space, creating more room for a larger battery or additional features.

"The Arteris interconnect IP helps us deliver a lower-cost solution to our customers while guaranteeing compatibility with industry-standard modem basebands," said Qiang Liu, Chairman and CEO at Ingenic. "In addition, Arteris' silicon-proven interconnect IP decreases our implementation and schedule risks."

"An increasing number of Chinese fabless application processor and modem vendors have licensed C2C to reduce the BOM cost and PCB area of TD-SCDMA/TD-LTE mobile phones and tablets. Ingenic's adoption of Arteris technology for its newest XBurst products is a strong endorsement of this standard," said K. Charles Janac, President and CEO of Arteris.

About Arteris

Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

Founded by networking experts, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.

About Ingenic

Ingenic Semiconductor was founded in Beijing in 2005 to develop innovative processor technology. Based on the MIPS architecture, Ingenic designs its own CPU core called XBurst. The XBurst CPU adopts an innovative micro-architecture which consumes very little power under high performance. Powered by the XBurst CPU, the company's JZ47xx series application processors are widely deployed in embedded devices and consumer electronic products including PMPs, educational electronic devices, eBooks, biometrics and more, with more than 30 million units shipped to-date. For more information, visit http://www.ingenic.cn/.

Arteris and the Arteris logo are trademarks of Arteris. C2C™ and Chip to Chip Link™ are trademarks of Texas Instruments, Incorporated. All other product or service names are the property of their respective owners.

For more Arteris information, contact:
Kurt Shuler
Arteris, Inc.
+1 408-470-7300
Email Contact

Mike Sottak
Wired Island, Ltd.
+1 408-876-4418
Email Contact

Outsourcing Trend: Semiconductor Fabs Need Service and Support for Legacy Tools From Refurbished Equipment Suppliers

Tue, 07 Feb 2012 13:00:00 +0000

ClassOne Equipment Expands Staff to Service and Support KLA-Tencor Legacy Tools to Address Growing Demand

Refurbished semiconductor equipment supplier ClassOne Equipment has bolstered its staff and added maintenance and service for KLA-Tencor legacy equipment to answer a growing demand from its customer base. ClassOne Equipment now offers service for the AIT, SP1 and SP2 platforms of KLA-Tencor defect inspection tools.

ClassOne also announced that they have added industry veterans Lyn Bursey, senior metrology technician, and Ed Dukats, service manager, to their staff to specifically support the KLA AIT, SP1 and SP2 systems worldwide. The new additions bring the current ClassOne Equipment staff to 40 employees.

Outsourcing Trend: Support and Service
Established 150mm and 200mm fabs are increasingly outsourcing support and service for legacy tools to reduce maintenance costs within the fab. For "super" legacy tools, such as the KLA AIT1 (defect inspection), UV-1050 (thin film measurement) and 5200 (overlay registration), fabs often look to secondary equipment suppliers as the best place to obtain support and service. The cost savings on service and parts can be significant and on certain super legacy tools the OEMs no longer inventory parts or provide service.

Joanne Itow, Semico Research analyst and major contributor to a report produced by Semico and SEMI about the secondary and services market, confirmed the trend: "Most manufacturing facilities have already maximized equipment productivity and process yields and are looking for more efficiencies by increasing wafer size. So these factories are now looking to the secondary equipment suppliers to help reduce costs by providing refurbishment, servicing and spare parts for 150mm and 200mm capacity."

"We can keep these legacy tools running longer," said Byron Exarcos, founder of ClassOne Equipment. "For the 'super' legacy tools specifically, those that are 10 to 20 years old, it's getting more and more difficult for fabs to get maintenance, service and parts from the OEM. I think that's one of the reasons that third party refurbishers have really flourished over the past several years. We've been growing the company to support these equipment sets because our customers are asking for that service. Our goal is to become the leading supplier of legacy tools and service for the KLA-Tencor product mix."

To inquire about ClassOne Equipment's service offerings for legacy KLA-Tencor tools, contact ClassOne at (770) 808-8708 or email sales@classoneequipment.com.

About ClassOne Equipment
ClassOne Equipment is a leading supplier of high-quality refurbished equipment to the semiconductor, MEMS, LED and emerging technologies markets. The company carries an extensive inventory of refurbished wafer fabrication and metrology equipment from top manufacturers such as KLA-Tencor, Hitachi, SUSS MicroTec, EVG, STS and Semitool at prices up to 65 percent less than the cost of a new tool. Its turnkey solution includes refurbishment to original specifications, industry-leading 3 or 6-month warranties, and installation and training by experienced technicians. Service, maintenance, and spare parts support is provided on all tools. Headquartered in Atlanta, GA, ClassOne has 40 full-time employees. For more information, please visit us at www.ClassOneEquipment.com.

Company Contact:
Byron Exarcos
+1-770-808-8708
Email Contact

Agency Contact:
Bruce Kirkpatrick
Kirkpatrick Communications
925.244.9100
Email Contact

sp3 Diamond Technologies Experiences 73 Percent Revenue Growth in 2011

Tue, 07 Feb 2012 13:00:00 +0000

Company Sees Strong Adoption of HF CVD Reactor Technology, Expands Into Larger Headquarters

sp3 Diamond Technologies, Inc. (sp3), a leading supplier of diamond products, deposition equipment and services, today announced that it saw a three-fold rise in shipments of its hot filament chemical vapor deposition (HF CVD) reactors and a 73 percent increase in revenue growth over the previous year. The company's growth drove the relocation of its headquarters to a larger facility in order to enhance its targeted wear products and wafer scale diamond development and production capabilities.

"We are at the tipping point where semiconductor and MEMS manufacturers, as well as suppliers to these and other key industries, are clearly capitalizing on the value diamond is able to bring to their businesses," said Dwain Aidala, president and COO of sp3 Diamond Technologies. "Diamond films provide an effective solution for CMP, MEMS, cutting tools, electrodes, thermal management and other manufacturing applications. We anticipate continued growth well into 2013 based on the accelerating adoption of diamond films and our free-standing diamond products such as DiaTherm™."

The company's new headquarters, located in Santa Clara, California, will facilitate development and production capacity expansion in high-growth application areas, particularly semiconductor manufacturing and wear products. sp3's CVD diamond coatings offer longer life for a wide range of material applications due to the superlative properties of diamond, including stiffness, chemical inertness, thermal conductivity, hardness and strength. These vastly improved material properties, combined with sp3's cost-effective deposition equipment, result in higher performance and lower costs for manufacturers.

"Our new facility's expanded production and research capabilities allow us to bring a broader portfolio of CVD diamond technologies to market," said Aidala. "Further, we have established strong relationships with local distributors around the world, including China, Japan, Korea and Taiwan to ensure the industry's best support and facilitate the implementation of diamond film deposition."

sp3 Diamond Technologies, Inc.
Founded in 1993 and based in Santa Clara, California, USA, sp3 Diamond Technologies, Inc. is a subsidiary of sp3 Inc., a full service provider of products and services relating to thin film and freestanding diamond deposition and other diamond materials. sp3 Diamond Technologies provides diamond products for advanced thermal applications, diamond coating and material services, hot filament CVD reactors, and deposition consulting services.

For more information about the company and its products and services please visit www.sp3diamondtech.com.

Company Contact:
Dwain Aidala
sp3 Diamond Technologies, Inc.
t: +1-408-492-0630
e: Email Contact

Press Contact:
Amy Smith
Impress Labs
t: +1-401-369-9266
e: Email Contact

NXP GreenChip Power ICs Set New Benchmarks for Low-Load Efficiency and No-Load Standby Power

Tue, 07 Feb 2012 10:05:00 +0000

GreenChip SPR TEA1716 Is Industry's First PFC and LLC Resonant Combo Converter to Enable EuP Lot 6 Compliance

NXP Semiconductors N.V. (NASDAQ: NXPI) today unveiled the GreenChip™ SPR TEA1716 switched-mode power supply (SMPS) controller IC -- the industry's first resonant PFC and LLC combo controller enabling ultra-low standby power at low loads, compliant with EU Ecodesign Directive requirements taking effect in 2013. The company also announced several highly cost-effective SPF (smart power flyback) ICs available in very small packages, including the GreenChip SPF TEA1731, as well as new additions to the TEA172x family, which also offer outstanding no-load performance. In addition, NXP introduced a new GreenChip synchronous rectification (SR) control IC, the TEA1792.

Building on NXP's success as the market leader in energy-efficient AC/DC power adapter ICs for notebook computers, the new GreenChip ICs enable compact, slim designs for chargers, adapters and power supplies across a broad range of applications. These include mobile communication devices such as smartphones and media tablets; portable computing devices such as e-readers, audio/video players, netbooks, Ultrabooks™ and PC peripherals; white goods such as washing machines, refrigerators, dishwashers and induction cookers; and industrial and residential systems for smart lighting, smart metering, HVAC, and home and building automation and control. NXP will showcase the new GreenChip power ICs this week at APEC 2012 in Orlando, Florida (booth 910).

"Like ENERGY STAR in the US, the EU Ecodesign Directive is helping to drive broader awareness of the importance of minimizing standby power. Energy shortages around the world also underscore the fact that we can't take 'always-on' for granted. NXP's new GreenChip SPR TEA1716 is ahead of the curve in driving low-load standby power down to half a watt and below, and is now sampling with lead customers developing power adapters that will meet the new EuP Lot 6 requirements," said Marcel van Roosmalen, general manager, power solutions product line, NXP Semiconductors.

Breakthrough in Low-Load Efficiency
The GreenChip SPR TEA1716 is a power factor correction (PFC) and LLC resonant combo converter featuring energy-saving operating modes that will help designers meet and exceed very stringent no-load and low-load standby requirements. Designed for use in 90-W to 500-W power supplies, the smart power resonant (SPR) TEA1716 combines PFC and a resonant half-bridge controller (HBC) in a SO24 package. With no-load power levels under 150 mW and an average efficiency of more than 91 percent over universal mains, the TEA1716 sets a new benchmark for standby efficiency as the first combo controller available today to enable standby consumption well below 0.5 watt at a load of approximately 250 mW, as specified under the EU Energy Using Products Directive (EuP) Lot 6.

Similarly, the new GreenChip SPF TEA1731 6-pin flyback converter offers best-in-class no-load IC power consumption, featuring a power-saving mode that enables less than 100 mW no load for adapters. In power-saving mode, the TEA1731 also enables power supplies to run below 0.5 W at 0.25-W load power -- for example, in supplying standby systems, thus enabling EuP Lot 6 compliance as well.

Enabling Low-Cost, Miniature Power Supply Design
The TEA1731 is one of several new GreenChip smart power flyback ICs from NXP which are highly integrated, reduce the number of external components required, and are available in very small packages to enable the miniaturization of adapters and power supplies, thus minimizing the total bill of materials. These cost-effective GreenChip SPF ICs also feature a complete set of protections to help maximize reliability, and include:

The GreenChip SPF TEA172x family of highly integrated flyback regulators designed for systems under 15 W and featuring sub-10 mW standby capability at 230 VAC mains input. Available in a compact SO7 package with HV spacer, the TEA172x family includes an integrated power MOSFET and primary output voltage sensing, which helps to automatically reduce current consumption when a charger is left plugged in, even when there is no device attached to be charged. The TEA1721 (up to 5 W), TEA1722 (for up to 8 W) and TEA1723 (for up to 11 W) also include built-in energy save control modes to enable the highest possible efficiency, and are fully compliant to USB1.1 and USB1.2 battery charging specification, delivering constant voltage (5V) and constant current at maximum load.
The GreenChip SPF TEA1731, a flyback converter packaged in a sub-miniature TSOP6 package, designed for low-cost, compact power supplies for 10 to 70-W systems. With a very low IC operating current and switching frequency efficiency optimization modes, the controller achieves 90-percent average efficiency for low-cost power supplies, in addition to enabling best-in-class no-load standby performance.

NXP's new GreenChip TEA1792 is a 6-pin synchronous rectification controller capable of driving a wide range of SR MOSFETs of all brands to the lowest possible RDS(on). Available in a TSOP6 package, the TEA1792 SR control IC requires minimal external components and reduces PCB real estate for the syncrec function significantly. Pairing the GreenChip TEA1792 alongside NXP's power SR MOSFETs in LFPAK, which offers automotive-grade ruggedness, enables high power density for very small charger designs. Other available packages for NXP's broad selection of power MOSFETs include TO220, I2PAK and D2PAK.

Pricing and Availability

Samples of the new GreenChip SMPS controller ICs are available starting in February and March 2012.
Indicative pricing is available upon request.

Links

GreenChip SPR TEA1716 product information: http://www.nxp.com/pip/TEA1716
GreenChip SPF TEA172x product information: http://www.nxp.com/pip/TEA1721
GreenChip SPF TEA1731 product information: http://www.nxp.com/pip/TEA1731
GreenChip TEA1792 product information: http://www.nxp.com/pip/TEA1792
NXP GreenChip solutions for power and lighting: http://www.nxp.com/greenchip
NXP power MOSFET portfolio: http://www.nxp.com/mosfets

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

The GreenChip SPR TEA1716 SMPS controller IC from NXP is first to enable ultra-low standby power at low loads, compliant with EU Ecodesign Directive requirements for 2013

The GreenChip SPF TEA172x family of highly integrated flyback regulators designed for systems under 15 W features sub-10 mW standby capability at 230 VAC mains input

The GreenChip SPF TEA1731 is a flyback converter packaged in a sub-miniature TSOP6 package, designed for low-cost, compact power supplies for 10 to 70-W systems

The NXP GreenChip TEA1792 is a 6-pin synchronous rectification controller capable of driving a wide range of SR MOSFETs of all brands to the lowest possible RDS(on)

NXP Power MOSFETs Enable Slimmer AC/DC Adapter Designs

Tue, 07 Feb 2012 10:00:00 +0000

NXP MOSFETS in LFPAK Deliver High Power Density and Automotive-Grade Ruggedness for Compact Mobile Chargers and Adapters

At APEC 2012 this week, NXP Semiconductors (NASDAQ: NXPI) is showcasing a wide range of highly efficient Power MOSFETs which can be used alongside its GreenChip™ switched-mode power supply (SMPS) controller ICs, to enable slimmer power supply, adapter and charger designs. NXP's robust Power MOSFETs provide an easy-to-use, space-saving solution for secondary-side synchronous rectifier (SR) applications, and can be used with SR control ICs such as the new GreenChip TEA1792, introduced by NXP in a separate announcement today: http://www.nxp.com/news/press-releases/2012/02/nxp-greenchip-power-ics-set-new-benchmarks-for-low-load-efficiency-and-no-load-standby-power.html

NXP's innovative Power MOSFETs in LFPAK enable higher power density designs with a smaller footprint, helping manufacturers meet new AC/DC adapter design requirements. LFPAK -- the industry's toughest Power-SO8 package -- brings automotive-grade ruggedness as required by AEC-Q101 to the power supply market. Featuring a copper clip which eliminates the need for wire bonding, LFPAK delivers maximum reliability, low electrical resistance, low thermal resistance, and a simplified manufacturing process. Supporting voltage ratings up to 200V, NXP's Power MOSFET portfolio also offers a broad selection of packages in addition to LFPAK, including TO220, I2PAK and D2PAK.

"The trend toward slimmer and more efficient power supplies is pushing the industry as a whole toward more compact form factors -- whether it's a charger or adapter for a music player, smartphone, tablet, notebook, or any device in between. Increasingly, power supply designers are taking advantage of NXP's LFPAK Power MOSFETs for very small, energy-efficient adapters, with the added benefit of automotive-grade reliability," said Chris Boyce, general manager, standard MOSFETs product line, NXP Semiconductors. "For adapter designs using GreenChip SMPS controller ICs for synchronous rectification, NXP offers a complete SR solution by offering a broad selection of Power MOSFETs -- in packages including LFPAK -- backed by the same high-volume manufacturing capability and commitment to continuous innovation."

NXP's GreenChip SMPS controller ICs and Power MOSFETs will be featured in booth 910 at APEC 2012 in Orlando, Florida through February 9, 2012.

Links

NXP Power MOSFET 2012 Selection Guide: http://www.nxp.com/documents/selection_guide/75017225.pdf
LFPAK: The Toughest Power-SO8 (Leaflet): http://www.nxp.com/documents/leaflet/75016838.pdf
NXP MOSFETs: http://www.nxp.com/mosfets
PSMN012-100YS - LFPAK, 100V, 60A
PSMN8R2-80YS - LFPAK, 80V, 82A
PSMN5R5-60YS - LFPAK, 60V, 100A
PSMN2R6-40YS - LFPAK, 40V, 100A
PSMN7R0-100PS - TO-220AB, 100V, 100A
PSMN3R3-80PS - TO-220AB, 80V, 120A
PSMN3R0-60PS - TO-220AB, 60V, 100A
PSMN1R5-40PS - TO-220AB, 40V, 100A
PSMN5R0-100ES - I2PAK, 100V, 120A
PSMN3R3-80ES - I2PAK, 80V, 120A
PSMN2R0-60ES - I2PAK, 60V, 120A
PSMN1R5-40ES - I2PAK, 40V, 120A
NXP GreenChip TEA1792 synchronous rectifier controller

PDF Attachment Available: http://www.nxp.com/documents/leaflet/75016838.pdf

NXP's innovative Power MOSFETs in LFPAK enable higher power density designs with a smaller footprint, helping manufacturers meet new AC/DC adapter design requirements

Pairing the GreenChip TEA1792 alongside NXP's power SR MOSFETs in LFPAK, which offers automotive-grade ruggedness, enables high power density for very small charger designs

Lattice Semiconductor to Present at Morgan Stanley's 2012 Technology, Media & Telecom Conference

Tue, 07 Feb 2012 10:00:00 +0000

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that it is scheduled to present at Morgan Stanley's 2012 Technology, Media & Telecom Conference on Monday, February 27 at the Palace Hotel in San Francisco. Darin G. Billerbeck, President and Chief Executive Officer, and Joe Bedewi, Corporate Vice President and Chief Financial Officer, will be presenting.

The presentation is scheduled for 4:15 p.m. PST and will be available through a listen only live webcast, which can be accessed through Lattice's investor relations website at www.lscc.com. Presentation materials will be available on the investor relations section of the Company's website at www.lscc.com.

About Lattice Semiconductor:
Lattice is the source for innovative FPGA, PLD and programmable Power Management solutions. For more information, visit www.latticesemi.com. Follow Lattice via Facebook, RSS and Twitter.

For More Information Contact:
Joe Bedewi
Chief Financial Officer
Lattice Semiconductor Corporation
503-268-8000

David Pasquale
Global IR Partners
914-337-8801
lscc@globalirpartners.com

Juniper Networks Adopts Jasper Formal Technology to Mitigate Design and Verification Risk

Tue, 07 Feb 2012 08:00:00 +0000

Jasper Design Automation, the leading provider of verification solutions based on formal technology, today announced that Juniper Networks has adopted JasperGold® formal technology for verification and design flows.

"We selected Jasper's solutions because of the clear advantages their tools and products offer over other options," said Sanjeev Kumar, ASIC senior manager at Juniper Networks. "We quickly recognized the value and quality improvements that Jasper's unique formal products can bring to our high-performance network products."

Juniper was able to load in its design, write properties, and begin using Jasper's unique formal techniques quickly. The Jasper Visualize™ feature allowed Juniper to thoroughly comprehend designs and swiftly correct any errors that were found.

"Being able to visualize RTL early in the design cycle, even without a need for a testbench, was key to our decision," added Kumar. "The remarkably intuitive and easy-to-use interactive debugging capabilities that Jasper provides will allow us to speed up design exploration and thus reduce design errors and market timing risks."

"Juniper's adoption of our products is a testament to the time-to-market benefits that our solutions offer," said Kathryn Kranen, President and CEO of Jasper Design Automation. "We look forward to partnering with Juniper to make Jasper formal technology a standard part of their design and verification flow in the future."

About Jasper Design Automation

Jasper delivers industry-leading EDA software solutions for semiconductor design, verification, and reuse, based on state-of-the-art formal technology. Customers include worldwide leaders in wireless, consumer, computing, and networking electronics. Jasper technology has been an integral part of over 150 successful chip deployments. Jasper, headquartered in Mountain View, California, is privately held, with offices and distributors in North America, South America, Europe, and Asia. Visit www.jasper-da.com to reduce risks, increase design, verification and reuse productivity; and accelerate time to market.

Jasper Design Automation and the Jasper Design Automation logo are trademarks or registered trademarks of Jasper Design Automation, Inc. All other trademarks mentioned are the property of their respective companies.

Contacts:
Rob van Blommestein
650-966-0234 p
Email Contact

Novellus Introduces VECTOR(R) Strata(TM) for Next Generation, Vertically Integrated Memory (VIM) Technology

Tue, 07 Feb 2012 01:00:00 +0000

New System Designed for Leading Memory Manufacturers Enables Ease of Patterning and High Yield at a Low Cost of Ownership

Novellus Systems (NASDAQ: NVLS) today announced the addition of the VECTOR Strata to the company's dielectric product offerings. VECTOR Strata has been developed specifically for high-volume manufacturing of vertically integrated memory (VIM) Flash devices. This is the second Novellus product announced in recent months for this emerging market, following the ALTUS® ExtremeFill tungsten CVD system introduced in July 2011. VECTOR Strata employs innovative technology designed to deliver ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure. The VECTOR's multi-station sequential processing (MSSP) architecture provides a unique solution to the cost of manufacturing for VIM that will allow acceleration of the technology into high volume production.

As the industry moves towards sub-20 nm nodes, traditional planar NAND flash devices are approaching scaling limitations. At these smaller device geometries, the close packing of memory cells results in a significant increase in parasitic inter-wire capacitance that in turn leads to increased cross talk and power consumption. Additionally, the closer proximity of adjacent memory cells causes shifts in the threshold value of a memory cell while an adjoining cell is being programmed, leading to memory disturbance. Finally, at sub-20 nm dimensions the number of electrons in the floating gate of a traditional planar NAND flash device is significantly reduced, to the point where multiple bits per cell are no longer possible and thus the extendibility of the technology becomes limited.

In order to address these challenges, NAND flash device manufacturers are aggressively pursuing different types of 3D VIM designs. Though the specific materials required in each of these structures are different, all of these approaches require alternating layers of silicon-based films. Each pair of alternating layers is used to form a memory cell, and up to 64 pairs of alternating layers are expected to be used in the formation of a VIM chip. Using this processing approach, underlying film roughness and defects within each layer can potentially be magnified while building up the VIM structure. To control these problems and ensure high yields, exceptional nano-particle control (required to reduce defectivity) and ultra-smooth film deposition (required to avoid word line edge variability, and hence word line performance variations) are both production requirements.

The new VECTOR Strata system has been designed to meet the stringent roughness and defectivity standards necessary to manufacture these next-generation VIM devices. Figure 1 shows a) VECTOR Strata's ultra-smooth films deposited in an alternating layer film stack in comparison to b) conventional PECVD films. The system also employs several innovative features that optimize gas delivery and RF distribution, resulting in industry-leading throughput and defect control. Figure 2 shows atomic force microscope (AFM) images of ultra-smooth VECTOR Strata films, showing film roughness that is comparable to the underlying substrate.

"VECTOR Strata deposits the low defect, ultra-smooth films required for next generation 3D NAND flash memory designs," said Sesha Varadarajan, senior vice president of Novellus' PECVD Business Unit. "VECTOR Strata has been adopted by leading memory manufacturers as the VIM development tool of choice due to its industry-leading advanced technology and multi-station sequential processing productivity."

For more information about the new VECTOR Strata, please visit www.novellustechnews.com.

About Novellus' PEVCD Technology:
The multi-station sequential processing (MSSP) architecture of Novellus' VECTOR platform allows for independent temperature and flow control to its deposition stations, a critical requirement to meet the integration needs of sub-3xnm technology nodes. More than 1,000 VECTOR systems have been installed in logic, memory, and foundry fabs around the world.

About Novellus:
Novellus Systems, Inc. (NASDAQ: NVLS) is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices across the globe. For more information, please visit www.novellus.com

Contact:
Bob Climo
Public Relations
Novellus Systems, Inc.
Phone: + 1 408/943-9700
Email: bob.climo@novellus.com

Robin Yim
Investor Relations
Novellus Systems, Inc.
Phone: + 1 408/943-9700
E-mail: robin.yim@novellus.com

Joe Kilmer
The Hoffman Agency
Phone: + 1 408/286-2611
Email: jkilmer@hoffman.com

Three Channel LED Driver From Supertex Delivers Sub-Microsecond PWM Dimming for LCD Backlighting Applications

Mon, 06 Feb 2012 14:00:00 +0000

HV9989 Features Patented Control Algorithm

Supertex, Inc. (NASDAQ: SUPX) today introduced HV9989, a three channel, boost LED driver integrated circuit (IC) designed to drive LEDs in LCD backlighting applications. It features Supertex's patented PWM dimming control algorithm that individually regulates each channel's output current down to sub-microsecond dimming pulses, which permits dimming at frequencies outside the audible range ( > 20kHz) without any shift in the "white point" or the color-correlated temperature. It drives strings of either RGB LEDS or multiple strings of white LEDs.

HV9989 drives boost or SEPIC converters in either continuous-conduction mode (CCM) or discontinuous-conduction mode (DCM). It features independent short- and open-circuit protection for each channel and three 1MHz transconductance amplifiers with tri-state outputs to close feedback loops and accurately control the LED current. It is powered by a built-in 40V linear regulator.

"HV9989 can operate with very high dimming frequency and deliver an over 10,000:1 dimming ratio because of its patented PWM dimming method," states Stephen Lin, Vice President of Marketing at Supertex. "The IC combines excellent line and load regulation in a multi-channel driver IC to reduce board space and system cost in LCD backlighting applications like flat screen TVs and monitors."

The HV9989 is available in a 40-lead QFN package (HV9989K6-G). Samples are available from stock. Lead-time for production quantities is 4-6 weeks ARO. Pricing is US$3.78 for the HV9989K6-G in 1K quantities.

About Supertex
Supertex, Inc. is a publicly held mixed signal semiconductor manufacturer, focused in high voltage analog and mixed signal products for use in the medical, LED lighting, printer and display, industrial and telecommunication industries. Supertex product, corporate and financial information is readily available at www.supertex.com.

Corporate Headquarters:
Ken Vickers
Manager, Marketing Communications
408/222-4810
kennethv@supertex.com

Inphi to Present at Stifel Nicolaus 2012 Technology & Telecom Conference

Mon, 06 Feb 2012 13:05:00 +0000

Inphi Corporation (NYSE: IPHI), a leading provider of high-speed analog semiconductor solutions for the communications and computing markets, today announced that John Edmunds, Vice President and Chief Financial Officer, will present at the Stifel Nicolaus 2012 Technology & Telecom Conference on February 7, 2012 at 4:45 p.m. Pacific Time. The conference will take place at the St. Regis Monarch Beach, Dana Point, Calif.

This event will be available via webcast at its referenced start time. Please visit the following link to view the webcast: http://investors.inphi.com.

About Inphi
Inphi Corporation is a leading provider of high-speed analog semiconductor solutions for the communications and computing markets, providing high signal integrity at leading-edge data speeds that are designed to address bandwidth bottlenecks in networks, minimize latency in computing environments and enable the rollout of next-generation communications infrastructure. Inphi's solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, storage platforms, test and measurement equipment and military systems. To learn more about Inphi, visit www.inphi.com.

Inphi, the Inphi logo and Think fast are registered trademarks of Inphi Corporation. All other trademarks used herein are the property of their respective owners.

Public Relations Contact:
Kim Markle
Inphi
408-217-7329
kmarkle@inphi.com