EIN Presswire: Semiconductors Press Releases

EV Group Receives First-ever Ranking Among Top Five VLSIresearch 10 BEST Suppliers of Chip Making Equipment

Thu, 24 May 2012 22:02:30 +0000

EV Group Receives First-ever Ranking Among Top Five VLSIresearch 10 BEST Suppliers of Chip Making Equipment

Jumps from 15th to 4th Place in 2012 10 BEST Focused Suppliers List; Also Named One of THE BEST Small Suppliers of Wafer Processing Equipment for Tenth Consecutive Year

PR Newswire

ST. FLORIAN, Austria, May 24, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that for the first time, its customers have ranked EVG as one of VLSIresearch's top five 10 BEST Focused Suppliers of Chip Making Equipment companies in the market research firm's extensive customer satisfaction survey results for 2012. EVG was also awarded third place in VLSIresearch's 2012 THE BEST Small Suppliers of Wafer Processing Equipment ranking, with its stellar product performance and customer service landing it on this list for the tenth consecutive year. Together, these rankings represent EV Group's best showing to date in the prestigious annual surveys, underscoring the success of the company's focused efforts to continually improve its products and services.

This year's VLSIresearch customer satisfaction survey represents feedback from more than 99 percent of the global chip market, garnered over a period of more than two months. Participants were asked to rate equipment suppliers among 15 categories based on three key factors: supplier performance, customer service, and product performance. EVG soared from the fifteenth position in 2011 to ranking fourth in 2012 in the 10 BEST Focused Suppliers category – the company's first-ever appearance on one of the two most important, aggregated 10 BEST Suppliers of Chip Making Equipment lists. In addition, its third-place spot among THE BEST Small Suppliers of Wafer Processing Equipment was a three-position jump from last year's survey results.

"We congratulate EV Group on achieving its first appearance within the top five of the 10 BEST list this year," said G. Dan Hutcheson, CEO of VLSI Research. "EVG continues to innovate and introduce leading-edge equipment for 3D IC semiconductor applications, while expanding and strengthening its position in new markets, such as LED manufacturing and optoelectronics. Moving up from 15th to 4th in our 10 BEST list of focused suppliers is an incredible accomplishment and signifies EV Group's solid focus on ensuring its customers receive best-of-class products and service."

"EV Group constantly evolves and implements new programs that raise the bar on delivering leading-edge equipment and service to our customers," said Hermann Waltl, EVG's executive sales and customer support director. "This year's achievements—a ranking in the top five of VLSIresearch's 10 BEST Focused Equipment Suppliers for the first time and again improving in THE BEST Small Suppliers of Wafer Manufacturing Equipment—reflect our commitment to ensuring all of our customers receive best-in-class service, support and solutions. We are honored to receive these awards, and we thank our customers for partnering with us to help create mutually beneficial working relationships."

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. More information is available at www.EVGroup.com.

SOURCE EV Group

Emulex Appoints Beatriz Infante to its Board of Directors

Thu, 24 May 2012 20:40:00 +0000

Emulex Appoints Beatriz Infante to its Board of Directors

Infante Brings Extensive Industry Experience Helping Companies Drive Growth

PR Newswire

COSTA MESA, Calif., May 24, 2012 /PRNewswire/ -- Emulex Corporation (NYSE: ELX) today announced that industry leader Beatriz Infante has been appointed to the Emulex Board of Directors. Ms. Infante brings extensive executive management, leadership and industry experience to Emulex, developing and executing on successful growth strategies for companies in the telecommunications, server, and unified communications industries.

(Logo: http://photos.prnewswire.com/prnh/20120403/NE81278LOGO)

"Beatriz Infante's extensive business leadership experience in cultivating high-growth companies fueled by innovative or disruptive technologies is well-suited to the objectives of our Board, as we continue our expansion into emerging markets," said Jim McCluney, chief executive officer (CEO), Emulex. "On behalf of the Board, we welcome her to the team."

Ms. Infante is the CEO of Business Excelleration LLC, a business transformation consultancy she founded in 2009, and also serves as director at Sonus Networks since 2010. Prior to these roles, Ms. Infante was the CEO and director of ENXSuite Corporation, a leading supplier of energy management solutions, from 2010 until its acquisition by Infor Global Solutions, Inc. in 2011. She served as CEO and director of VoiceObjects Inc., a market leader in voice application servers, from 2006 to 2008, until its acquisition by Voxeo Corporation. From 2004 to 2005, Ms. Infante served as Interim CEO and director of Sychron Inc., which was acquired by an investor group. From 1998 to 2003, Ms. Infante held various positions with Aspect Communications (at the time listed under NASDAQ:ASPT), a leading provider of call centers and unified communications solutions, including the roles of Chairman, President and CEO. Under her leadership, Aspect achieved record revenues and transformed from a primarily hardware company to a high-margin software and services provider. Ms. Infante was also an Executive-in-Residence at U.S. Venture Partners, a leading Silicon Valley venture capital firm, from 2009 to 2010; and from 1994 to 1998 held various roles at Oracle Corporation, including senior vice president Application Servers reporting directly to Larry Ellison.

Ms. Infante currently serves on the Advisory Committee to the Princeton University School of Engineering and Applied Science and is an advisor and investor in several early-stage technology companies. She is currently a member of the Board of Directors of 1010data, Inc., a company which provides a cloud-based data warehouse/business intelligence platform. She has also served as director at Silicon Valley Leadership Group and Joint Venture Silicon Valley Network. Ms. Infante holds a Bachelor of Science and Engineering degree in Electrical Engineering and Computer Science from Princeton University and a Master of Science degree in Engineering Science from California Institute of Technology.

"It is a pivotal time for Emulex, as it extends into new markets and verticals, and continues to bring high performance I/O connectivity to enterprise data centers as they deploy next-generation servers and new technologies," said Beatriz Infante. "The convergence of server and storage networking is one of the industry's great growth trends, and one which Emulex is well positioned to capture. I am very excited to join the Emulex Board, leveraging my background in cultivating company growth and expansion into new market segments."

To learn more about Emulex, please visit: http://www.emulex.com

Follow Emulex on Twitter: http://www.twitter.com/emulex

About Emulex
Emulex, the leader in converged networking solutions, provides enterprise-class connectivity for servers, networks and storage devices within the data center. The Company's product portfolio of Fibre Channel host bus adapters, 10Gb Ethernet network interface cards, Ethernet-based converged network adapters, controllers, embedded bridges and switches, and connectivity management software are proven, tested and trusted by the world's largest and most demanding IT environments. Emulex solutions are used and offered by the industry's leading server and storage OEMs including, Cisco, Dell, EMC, Fujitsu, Hitachi, Hitachi Data Systems, HP, Huawei, IBM, NEC, NetApp and Oracle. Emulex is headquartered in Costa Mesa, Calif., and has offices and research facilities in North America, Asia and Europe. More information about Emulex (NYSE:ELX) is available at www.Emulex.com.

Emulex Safe Harbor Statement
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: With the exception of historical information, the statements set forth above include forward-looking statements that involve risk and uncertainties. Emulex wishes to caution readers that a number of important factors could cause actual results to differ materially from those in the forward-looking statements. Those factors include among others, intellectual property claims, with or without merit, that could result in costly litigation, cause product shipment delays, require Emulex to indemnify customers, or require Emulex to enter into royalty or licensing agreements, which may or may not be available. Furthermore, Emulex have in the past obtained, and may be required in the future to obtain, licenses of technology owned by other parties. Emulex cannot be certain that the necessary licenses will be available or that they can be obtained on commercially reasonable terms. If Emulex were to fail to obtain such royalty or licensing agreements in a timely manner and on reasonable terms, Emulex's business, results of operations and financial condition could be materially adversely affected. Ongoing lawsuits, such as the action brought by Broadcom Corporation ("Broadcom"), present inherent risks, any of which could have a material adverse effect on Emulex's business, financial condition, or results of operations. Such potential risks include continuing expenses of litigation, risk of loss of patent rights and/or monetary damages, risk of injunction against the sale of products incorporating the technology in question, counterclaims, attorneys' fees, incremental costs associated with product or component redesigns, and diversion of management's attention from other business matters. With respect to the Broadcom litigation such potential risks also include the availability of an adequate sunset period of time to make design changes, the ability to implement any design changes, the availability of customer resources to complete any re-qualification or re-testing that may be needed, the ability to maintain favorable working relationships with Emulex suppliers of SerDes modules and the ability to obtain a settlement that does not put Emulex at a competitive disadvantage. In addition, the fact that the economy generally, and the technology and storage segments specifically, have been in a state of uncertainty makes it difficult to determine if past experience is a good guide to the future and makes it impossible to determine if markets will grow or shrink in the short term. The current economic downturn and the resulting disruptions in world credit and equity markets that are creating economic uncertainty for Emulex's customers and the storage networking market as a whole has and could continue to adversely affect Emulex's revenues and results of operations. Furthermore, the effect of any actual or potential unsolicited offers to acquire Emulex may have an adverse effect on Emulex's operations. As a result of these uncertainties, Emulex is unable to predict its future results with any accuracy. Other factors affecting these forward-looking statements include, but are not limited to, the following: faster than anticipated decline in the storage networking market; slower than expected growth of the storage networking market or the failure of Emulex's Original Equipment Manufacturer ("OEM") customers to successfully incorporate Emulex products into their systems; Emulex's dependence on a limited number of customers and the effects of the loss of, decrease in or delays of orders by any such customers, or the failure of such customers to make timely payments; the emergence of new or stronger competitors as a result of consolidation movements in the market; the timing and market acceptance of Emulex products or Emulex OEM customers' new or enhanced products; costs associated with entry into new areas of the storage technology market; the variability in the level of Emulex's backlog and the variable and seasonal procurement patterns of Emulex's customers; any inadequacy of Emulex's intellectual property protection and the costs of actual or potential third-party claims of infringement and any related indemnity obligations or adverse judgments; impairment charges, including but not limited to goodwill and intangible assets; changes in tax rates or legislation; the effects of acquisitions; the effects of terrorist activities; natural disasters, such as the earthquake and resulting tsunami off the coast of Japan in March 2011 and the significant flooding in various parts of Thailand in October 2011, and any resulting disruption in Emulex's supply chain or customer purchasing patterns or any other resulting economic or political instability; the highly competitive nature of the markets for Emulex products as well as pricing pressures that may result from such competitive conditions; the effects of changes in Emulex's business model to separately charge for software; the effect of rapid migration of customers towards newer, lower cost product platforms; possible transitions from board or box level to application specific integrated circuit ("ASIC") solutions for selected applications; a shift in unit product mix from higher-end to lower-end or mezzanine card products; a faster than anticipated decrease in the average unit selling prices or an increase in the manufactured cost of Emulex products; delays in product development; Emulex's reliance on third-party suppliers and subcontractors for components and assembly; Emulex's ability to attract and retain key technical personnel; Emulex's ability to benefit from research and development activities; Emulex's dependence on international sales and internationally produced products; changes in accounting standards; and the potential effects of global warming and any resulting regulatory changes on Emulex's business. These and other factors that could cause actual results to differ materially from those in the forward-looking statements are also discussed in Emulex's filings with the Securities and Exchange Commission, including its recent filings on Forms 8-K, 10-K and 10-Q. Statements in this release are based on current expectations and, except as required by law, Emulex undertakes no obligation to revise or update any forward-looking statements for any reason. All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies.

Investor Contact:	Press Contact:
Frank Yoshino	Katherine Lane
Vice President, Finance	Director, Corporate Communications
+1 714 885-3697	+1 714 885-3828
frank.yoshino@emulex.com	katherine.lane@emulex.com

SOURCE Emulex Corporation

Axcelis Technologies, Inc. Reiterates Q2 2012 Guidance

Thu, 24 May 2012 20:10:00 +0000

Axcelis Technologies, Inc. Reiterates Q2 2012 Guidance

PR Newswire

BEVERLY, Mass., May 24, 2012 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS) reiterated its expectations for the second quarter of 2012, originally communicated in the Company's first quarter earnings call on May 3, 2012. Axcelis expects financial results for the quarter ending June 30, 2012 to include:


- Revenue:	$60-70 million
- Gross Margins:	Decline of 5-6 points from Q1 2012 level of 37.3%
- Operating Expenses:	$25 million, excluding restructuring charges
- Operating Loss:	($4 – 6) million
- EPS:	($0.04-0.06)
- Cash and Cash Equivalents:	Flat to slightly down from Q1 2012 level of $37.2 million

The Company also announced it will be attending the Craig-Hallum 9th Annual Institutional Investor Conference on May 30, 2012 in Minneapolis, Minnesota, and the Needham & Company Semiconductor Equipment Bus Tour on June 5, 2012 in Chelmsford, Massachusetts.

Axcelis Technologies, Inc. (Nasdaq: ACLS), headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation and cleaning systems. For more information, visit the company's website at: www.axcelis.com.

CONTACTS:

Maureen Hart (editorial/media) 978.787.4266
Jay Zager (financial community) 978.787.9408

SOURCE Axcelis Technologies, Inc.

Synopsys to Present at 40th Annual Cowen TMT Conference

Thu, 24 May 2012 20:05:00 +0000

Synopsys to Present at 40th Annual Cowen TMT Conference

PR Newswire

MOUNTAIN VIEW, Calif., May 24, 2012 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced that John Chilton, senior vice president of marketing and corporate development, will speak at the 40th Annual Cowen Technology, Media & Telecom Conference in New York, on May 31, 2012.

This event will be broadcast live on the Internet via the Synopsys corporate website at http://www.synopsys.com/Company/InvestorRelations on Thursday, May 31, 2012 at 9:30 a.m. ET (6:30 a.m. PT). To access the live audio webcast, please go to the Synopsys corporate website at least ten minutes prior to the start of the presentation to register and to download and install any necessary multimedia software. A webcast replay of the event can also be accessed at the Synopsys corporate website.

About Synopsys

Synopsys, Inc. (Nasdaq:SNPS) is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. Synopsys' comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, system-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has approximately 70 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at http://www.synopsys.com/.

Investor Contact:
Roberta Reid
Synopsys, Inc.
(650) 584-1901

SOURCE Synopsys, Inc.

TI CEO Rich Templeton to speak at Sanford Bernstein investor conference

Thu, 24 May 2012 19:45:00 +0000

TI CEO Rich Templeton to speak at Sanford Bernstein investor conference

Live webcast at www.ti.com/ir

May 30, 2012, 9 a.m. Eastern time

PR Newswire

DALLAS, May 24, 2012 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) Chairman, President and CEO Rich Templeton will speak at Sanford C. Bernstein's 28th Annual Strategic Decisions Conference in New York City on Wednesday, May 30, at 9 a.m. Eastern time. Templeton will field questions from analysts and investors, as well as discuss TI's business outlook and strategy to address key markets for its analog and embedded processing technologies and how these capabilities position the company for growth.

The audio webcast can be accessed live through the Investor Relations section (http://www.ti.com/ir) of TI's website. An archived replay will be available on the website after his remarks.

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

TXN-F

SOURCE Texas Instruments Incorporated

MEDIA ALERT: eSilicon to Join With ChipEstimate, Synopsys, Magma and TSMC at DAC 2012

Thu, 24 May 2012 19:33:00 +0000

Create Superior Products with Selective Memory Customization
ChipEstimate IP Talks: Booth #1202
Patrick Soheili, eSilicon's VP and GM, IP Solutions Group, will be presenting Create Superior Products with Selective Memory Customization at ChipEstimate IP Talks. Learn how custom IP can optimize your chip's power, performance or area.

Monday, June 4,10:00 AM
Tuesday, June 5, 2:30 PM
Wednesday, June 6, 11:00 AM

Synopsys Next-Generation Hierarchical Timing Technology - HyperScale
Synopsys PrimeTime SIG at DAC 2012
Prasad Subramaniam, eSilicon's VP of design technology, will be hosting a table at the Synopsys Primetime SIG event.
When:
Monday, June 4, 6:00 - 8:30 PM
Where:
Francisco Marriott Marquis, Golden Gate Ballroom A 55 Fourth Street
Dinner and beverages are complimentary

Divide and Conquer - Intelligent Partitioning
Magma/Synopsys Booth #310
This panel will discuss what's needed from synthesis, verification and physical design tools to make partitioning work for today's designs, budgets, resources and delivery schedules.
When:
Wednesday, June 6, 1:30 - 2:15 PM
Moderator:
Paul McLellan - SemiWiki
Speakers:
Hao Nham - eSilicon Corporation
Jonathan DeMent - IBM Systems and Technology Group
Santosh Santosh - NVIDIA Corporation

Satiating the Hunger for Memory Bandwidth in Networking Applications
TSMC OIP: TSMC DAC Theater
Patrick Soheili, eSilicon's VP and GM, IP Solutions Group, will present how specialized memory products, such as content-addressable memory (CAM) and multi-port register files can be used in networking applications.

Tuesday, June 5, 4:15 - 4:25 PM
Wednesday, June 6, 10:15 - 10:25 AM

eSilicon is a registered trademark, and the eSilicon logo and Enabling Your Silicon Success are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

For more information or to schedule a meeting with eSilicon at DAC, contact:
Susan Cain
Cain Communications
503-538-2747
Email Contact

MEMC Acknowledges S&P Action

Thu, 24 May 2012 16:23:40 +0000

MEMC Acknowledges S&P Action

PR Newswire

ST. PETERS, Mo., May 24, 2012 /PRNewswire/ -- MEMC Electronic Materials, Inc. (NYSE: WFR) acknowledged S&P's downgrade of MEMC's senior debt to a B+ rating today.

"We are disappointed with the rating change by S&P," commented Brian Wuebbels, MEMC's Chief Financial Officer, "but we are comfortable that our cash and liquidity position is sufficient to meet our current cash needs. The credit downgrade by S&P today will not adversely affect our current access to our existing non-recourse construction revolver for SunEdison construction activities."

About MEMC

MEMC is a global leader in semiconductor and solar technology. MEMC has been a pioneer in the design and development of silicon wafer technologies for over 50 years. With R&D and manufacturing facilities in the U.S., Europe, and Asia, MEMC enables the next generation of high performance semiconductor devices and solar cells. Through its SunEdison subsidiary, MEMC is also a developer of solar power projects and a worldwide leader in solar energy services. MEMC's common stock is listed on the New York Stock Exchange under the symbol "WFR." For more information about MEMC, please visit www.memc.com.

Forward-Looking Statements

Certain matters discussed in this press release are forward-looking statements, including that our cash and liquidity position is sufficient to meet our current cash needs; and that the credit downgrade by S&P today will not adversely affect our current access to our existing non-recourse construction revolver for SunEdison construction activities. Such statements involve certain risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. Potential risks and uncertainties include concentrated project development risks related to large scale solar projects; the availability of attractive construction, project finance and other capital for SunEdison projects; changes in the pricing environment for silicon wafers and polysilicon, as well as solar power systems; market demand for our products and services; the availability and size of government and economic incentives to adopt solar power, including tax policy and credits and renewable portfolio standards; the ability to effectuate and realize the savings from the restructuring plan; our ability to maintain adequate liquidity and compliance with our debt covenants; the effect of any antidumping or countervailing duties imposed on photovoltaic cells and/or modules in connection with any trade complaints in the United States or elsewhere; existing or new regulations and policies governing the electric utility industry; our ability to convert SunEdison pipeline into completed projects in accordance with our current expectations; general economic conditions, including interest rates; the ability of our customers to pay their debts as they become due; failure of third-party subcontractors to construct and install our solar energy systems; seasonality or quarterly fluctuations in our SunEdison business; the impact of competitive products and technologies; inventory levels of our customers; supply chain difficulties or problems; interruption of production; good working order of our manufacturing facilities; our ability to reduce manufacturing and operating costs; assumptions underlying management's financial estimates; actions by competitors, customers and suppliers; changes in the retail industry; damage to our brand; acquisitions of pipeline in our Solar Energy segment; changes in financial market conditions; changes in foreign economic and political conditions; changes in technology; changes in currency exchange rates and other risks described in the company's filings with the Securities and Exchange Commission. These forward-looking statements represent the company's judgment as of the date of this press release. The company disclaims, however, any intent or obligation to update these forward-looking statements.

SOURCE MEMC Electronic Materials, Inc.

Silicon Frontline Adds New Capabilities; Focuses on Semiconductor Power Device Reliability and Efficiency, Accurate 3D Parasitic Extraction, Point-to-Point Resistance

Thu, 24 May 2012 15:58:00 +0000

Demos Set for Design Automation Conference, June 4-6, San Francisco, Booth 2900

Silicon Frontline Technology, Inc. (SFT) an Electronic Design Automation (EDA) company, in the 3D parasitic extraction and analysis software market, announced new versions of its flagship products, F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures, and a new product P2P (Pont-to-Point) for IR drop analysis.

What's New
F3D: Increased speed & capacity
F3D is chosen for its nanometer and A/MS design verification accuracy. To address the growing complexity of today's nanometer designs, F3D is now faster and handles larger designs. A new segment mode provides better performance improvement as circuit size increases. F3D has improved handling of active and passive devices in addition to support of co-planar structures. These capabilities provide support for newer and more complex geometries.

F3D benefits include:

Better performance for larger designs
Analysis of larger (unlimited) size designs
Improved handling of active and passive devices for new technology nodes

R3D: Layer-by-layer comparisons, transient-gate analysis
R3D is used for analysis that improves the reliability and efficiency of semiconductor power devices. R3D has been adopted by over 20 customers and applied to MOS, DMOS, LDMOS, vertical DMOS, waffle-style and GaN HEMT designs.

The new version of R3D allows for easy comparison of design enhancements both graphically and with a new layer-by-layer resistance report. If design changes are made, the analysis includes the impact on RDson and current density.

A new option supports transient analysis of gate networks, which allows for switching optimization. As power devices become larger, managing gate switching is critical to ensure correct operation. R3D Gate extracts and analyzes the gate network providing graphical and textual results. Issues are quickly identified and resolved ensuring proper operation of the device is achieved.

P2P: Point-to-Point Resistance Analysis
Silicon Frontline is delivering its new P2P product for point-to-point or multipoint to multipoint resistance analysis and fast, static IR drop analysis.

Silicon Frontline Product Demonstrations at Design Automation Conference (DAC)
Monday-Wednesday, June 4-6, 2012 9 am to 6 pm
Booth #2900
Moscone Convention Center, San Francisco, California
To make an appointment, please email info@siliconfrontline.com.

About Silicon Frontline
Silicon Frontline Technology, Inc. provides post-layout verification software that is Guaranteed Accurate and works with existing design flows from major EDA vendors. Using new 3D technology, the company's software products improve silicon quality for standard and advanced nanometer processes. For more information please visit www.siliconfrontline.com. For sales or general assistance, please email info@SiliconFrontline.com.

Notes to editors:
Acronyms and Definitions
A/MS: Analog Mixed Signal
DMOS: Double-diffused Metal Oxide Semiconductor
EDA: Electronic Design Automation
F3D: Fast 3D
GaN: Gallium Nitride
HEMT: High Electron Mobility Transistor
IR Drop Voltage Drop Analysis
LDMOS: Laterally Diffused Metal Oxide Semiconductor
MOS: Metal Oxide Semiconductor
R3D: Resistive 3D
Rdson: Resistance from drain to source

All trademarks and tradenames are the property of their respective holders.

Press Contact:
Georgia Marszalek
ValleyPR LLC
+1 650 345 7477
Georgia@ValleyPR.com

New Sensing Solutions to Be Introduced at Sensors Expo & Conference

Thu, 24 May 2012 15:17:00 +0000

More than 150 exhibitors will showcase the newest technologies for sensors and sensors-related industries at the 2012 Sensors Expo & Conference, June 6-7 at the Donald E. Stephens Convention Center in Rosemont, IL. Following is a sampling of the state-of-the-art measurement and monitoring devices for MEMS, Energy Harvesting, Mobile Sensing, Wireless Sensor Networking and more that will be on display Wednesday, June 6 from 10 a.m. - 5 p.m. and Thursday, June 7 from 10 a.m. - 3 p.m.

austriamicrosystems AG (Booth 615) has two new sensors to present. The first AS3935 Franklin Lightning Sensor IC is the world's first lightning sensor IC targeting low-power, portable applications. The new AS5132 contact-less angular position sensor is a magnetic position sensor IC offering accurate angular measurement over a full 360-degree turn.
Freescale Semiconductor (Booth 911) will present three state-of-the art demos with feature videos of their new products. The Xtrinsic Capacitive and Resistive Touch-Sensing (CRTouch) Platform enables resistive touch screens to handle basic gesture recognition; Windows 8 Freescale 12-Axis Xtrinsic Sensor Platform, which extends the Microsoft Windows 8 Mandate for sensor fusion in tablets, slates, convertible laptops and other mobile devices; and the Kinetis KW20 Wireless MCU and MC13242 RF Transceiver, the industry's most scalable wireless platform enabling a range of applications including smart energy, smart metering and building control applications.
Hoffmann + Krippner (Booth 608) will display the Sensonik®. This product offers a considerably simplified production process using new generation of polymer thick film technology to provide excellent linearity, extreme durability and high temperature stability.
INTEGRATED Engineering Software (Booth 303) to introduce their Application Programming Interface (API), which enables customers to integrate CAE software programs to the applications they need for their design analysis.
Linear Technology (Booth 1020) is showing their extensive energy harvesting power management ICs and Wireless Sensor Network products from their Dust Networks Product Group.
MaxBotix Inc. (Booth 426) will showcase the new HRLV-MaxSonar-EZ Ultrasonic High Resolution 1mm Accuracy Sensor. Offering simultaneous multi-sensor operation, automatic speed of sound changes due to temperature, low operating voltage and current.
Plessey Semiconductors (Booth 627) is demonstrating two types of Heart Monitoring technologies this year. The Heart Monitor Wrist Watch can be used for exercise with a simple touch and no chest strap. This tool shows that effective personal ECG monitoring can be easy. The second design is to provide continuous heart monitoring and straps to the upper arm. Plessey Semiconductors will also introduce an automotive sensor product, the PS25203. This sensor offers driver monitoring for improved safety within the vehicle.
Schneider Electric and Gas Sensing Solutions (Booth 302) to showcase a unique temperature, humidity and CO2 wireless sensor. This is the world's first solution that can run for 10 years with a single AA battery.
Synkera Technologies Inc. (Booth 423) will be exhibiting the new UltraKera MOS sensor prototypes. UltraKera offers even lower power consumption than previous sensors and was designed with portable, wireless and embedded sensor applications in mind.
Vibration Research Corporation (Booth 508) will be exhibiting its 5th generation vibration control system hardware (VR9500 Revolution) with Version 10 software for electro-dynamic & servo-hydraulic shakers.
YEI Technology (Booth 85) will be featuring the 3-Space family of AHRS/IMU, a line of miniature, high-precision, high-reliability IMU and AHRS, new the sensors market. YEI 3-Space is affordable and accurate while boasting the smallest size available on the market today

Sensors Expo & Conference, the leading sensors event in North America, will bring together thousands of engineers, scientists and industry professionals from around the world to see the latest innovations in sensor technology, learn about the most important sensing trends and network with industry leaders. The conference program is dedicated to exploring the most up-to-date innovations in sensor technology, including Applied Sensing, Big Data & Analytics, Cloud, Energy Harvesting, Measurement & Detection, MEMS, Mobile Sensing, RFID/M2M, Sensor & System Design, Wireless Sensing, and more. Sensors Expo & Conference identifies cutting-edge trends, explores them in an information-packed conference program and reflects those trends throughout the exhibit floor with new product announcements, key technology focused areas, such as the Energy Harvesting Pavilion, MEMS Pavilion, Big Data & Cloud Pavilion, and Wireless Pavilion, as well as a showcase of hundreds of products and services and the Best of Sensors Expo 2012 Awards presented by Sensors Magazine.

About Sensors Expo & Conference
Sensors Expo & Conference is the only industry event in North America exclusively focused on sensors and sensor integrated systems, providing over 25 years of technical innovation and thought leadership! The Expo & Conference is produced by Questex Media Group and sponsored by Sensors Magazine. Visit www.sensorsexpo.com for the latest information on the 2012 event.

For further information, contact:
Amy Riemer
Media Relations
978-475-4441 (office)
978-502-4895 (cell)
Email Contact

Uniquify Launches ideas2silicon Design Services Platform

Thu, 24 May 2012 15:00:00 +0000

Provides Rapid Implementation of SoCs, Super SoCs, Transparent Business Model

Uniquify (www.uniquify.com) today launched ideas2silicon™, a new and comprehensive design services platform that spans chip specification and design through volume delivery of packaged and tested parts.

ideas2silicon turns the model upside down by offering faster turnaround, lower costs and a transparent business model that gives project teams complete visibility into the cost structure. "The traditional 'turnkey' model is not working and we're doing something about it," says Josh Lee, chief executive officer and founder of Uniquify, provider of ASIC/SoC design and manufacturing services and patented low-power double data rate (DDR) subsystem IP developer. "Projects teams have been frustrated with the classic model, as it effectively locks them into an expensive business relationship that is hard to change."

Perseus™, a proven proprietary design framework for fast, repeatable and consistent turnaround on complex designs, forms the foundation of ideas2silicon. It provides a disciplined methodology for managing the design and closure of complex system-on-chip (SoC) and Super SoC (SSoC) designs with multiple processors, special-purpose processing engines, on-chip networks, memories and different peripheral and I/O functions.

Additionally, Uniquify's design services expertise comes from serving as the design arm for more than 120 fabless semiconductor companies, electronic system manufacturers, semiconductor foundries, IDMs, ASIC companies and EDA vendors.

Introducing ideas2silicon Design Services Platform
ideas2silicon delivers predictable and efficient execution of the most complex ASIC, SoC and SSoC designs. A key component is an automated capability for rapidly selecting, qualifying and integrating IP blocks that form the backbone of a new design.

Availability of this IP affords project teams earlier testing and verification of their own differentiating design blocks and IP. Services range from specification and architectural design, field programmable gate array (FPGA) prototyping, register transfer level (RTL) design and verification through complete physical design and verification.

Uniquify's highly qualified design team has expertise in advanced 65-, 40- and 28-nanometer process technologies from foundries including TSMC, Samsung, GLOBALFOUNDRIES and SMIC. These design experts have experience meeting the stringent performance, low power, OCV-aware, IP integration and verification, design for manufacturing and requirements of a project team's most challenging SoC designs.

Uniquify partners with EDA suppliers, including Cadence, Mentor and Synopsys, for the automation software needed to support these complex designs within Perseus.

Expertise in High-Performance IP Development, Implementation
With SoCs containing an IP content of 50-60% or more, Uniquify has developed a portfolio of patented, high-performance DDR memory subsystems that can be applied for rapid implementation to address the need for tested and pre-qualified IP.

Uniquify is driving a new IP paradigm that recognizes that delivering IP functionality alone is not sufficient, but must be "variation aware" as well. It developed variation-aware, high-performance and silicon-proven Self-Calibrating Logic and Dynamic Self-Calibrating Logic (DSCL) IP for DDR memory subsystems to solve both static and dynamic variation problems during system operation. This patented technology includes controllers, PHY and I/O for use on a variety of applications.

About Uniquify
Uniquify is a privately held, rapidly growing application specific integrated circuit (ASIC)/system-on-chip (SoC) design and Super SoC (SSoC) integration and manufacturing services provider and an innovative developer and provider of patented, low-power DDR memory sub-system semiconductor IP. The company has design centers in Santa Clara, Calif., Pune, India, and Seoul, Korea. It maintains sales offices in Santa Clara and Seoul, along with Taipei, Taiwan, and Tel Aviv, Israel. With more than 100 employees, Uniquify offers 65-, 40- and 28-nanometer ASIC and SoC design expertise, SSoC integration and manufacturing services and high-performance IP to leading semiconductor and system companies worldwide. Additional information can be found at: www.uniquify.com.

Uniquify acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

For more information, contact:
Bob Smith
Uniquify
(650) 269-8780
Email Contact

Nanette Collins
Public Relations for Uniquify
(617) 437-1822
Email Contact

Carbon Design Systems, Cadence Partner for IP Optimization

Thu, 24 May 2012 14:30:00 +0000

Performance Analysis Kit Delivers Benchmark Results in Minutes

Carbon Design Systems® Inc., a leading supplier of virtual prototype and secure model solutions, and Cadence Design Systems® announced today availability of a Carbon Performance Analysis Kit (CPAK) to accelerate the intellectual property (IP) benchmark process.

The CPAK incorporates a Cadence double data rate (DDR3) Memory Controller together with an ARM® Cortex™-A9 MPCore™ processor, and industry-standard benchmarks, such as those from EEMBC®.

"Optimization of the processor to memory datapath plays a key role in the development of many leading-edge SoCs," remarked Rick Lucier, president and chief executive officer at Carbon. "By partnering with Cadence to deploy this CPAK, we are enabling engineers to be more productive by benchmarking the same day they download the package from Carbon IP Exchange."

"Being able to quickly demonstrate the value and ease of use of our memory controller models is a great aid to our customers," stated Vishal Kapoor, vice president of marketing, SoC Realization Group at Cadence. "This Performance Analysis Kit bypasses any traditional setup issues and enables engineers to be productive immediately."

"The Carbon/Cadence Performance Analysis Kit executing CoreMark highlights the important role that industry standard benchmarks can play in the IP selection process," added Markus Levy, president of EEMBC.

"ARM power-efficient technology is at the heart of many products, ranging from embedded microcontroller applications to servers, network infrastructure and smart connected devices," commented Joe Convey, Director of Design Enablement, ARM. "Reference implementations, such as the Carbon/Cadence Performance Analysis Kit, are important tools that allow ARM Partners to innovate more easily by quickly understanding capabilities of the Cortex-A9 processor."

About the Platform
The Carbon/Cadence offering is the latest addition to the library of Carbon Performance Analysis Kits available from Carbon's IP Exchange web portal (www.carbonipexchange.com). This platform features an ARM Cortex-A9 processor and a Cadence DDR3 memory controller, along with configurable models for the interconnect fabric, DDR3 memory and memory PHY.

In addition, multiple configurable traffic generators are included as producers and consumers to model additional bus traffic. Included in the system is a software package that includes, among other tests, the CoreMark benchmark from EEMBC. The CPAK executes in Carbon's SoCDesigner Plus virtual prototype environment that delivers a rich suite of analysis and visualization tools.

Availability
The Carbon/Cadence CPAK is available now from Carbon's IP Exchange web portal: www.carbonipexchange.com. The ported CoreMark benchmarking software is available from www.coremark.org.

Carbon and Cadence are part of the ARM Connected Community®, a global network of over 900 companies with access to a wide variety of resources and aligned to provide optimized solutions based on the ARM architecture.

About Carbon Design Systems
Carbon offers the industry's only unified virtual prototype solution along with the leading solution for accurate IP model creation. Carbon virtual platforms can execute at 100s of MIPS and with 100% accuracy to enable application software development, detailed architectural analysis and secure IP model distribution. Carbon's solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, CASI, CADI and CAPI. Carbon's customers are systems, semiconductor, and IP companies that focus on wireless, networking, and consumer electronics. Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720. Telephone: (978) 264-7300. Facsimile: (978) 264-9990. Email: info@carbondesignsystems.com. Website: www.carbondesignsystems.com.

Carbon Design Systems is a trademark of Carbon Design Systems Inc. Carbon acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

ARM, Cortex and MPCore are registered trademarks of ARM Limited.

For more information, contact:
Bill Neifert
Vice President of Business Development
Carbon Design Systems
(978) 264-7302
Email Contact

Synopsys Hosts Special Events with Industry Leaders at DAC 2012

Thu, 24 May 2012 13:10:00 +0000

Synopsys Hosts Special Events with Industry Leaders at DAC 2012

Events feature in-depth discussions of best practices for today's designs and the emerging trends and advanced technology that will enable the next 25 years of innovation

PR Newswire

MOUNTAIN VIEW, Calif., May 24, 2012 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, will host several special events at the Design Automation Conference, June 3 - 7 in San Francisco, Calif. The events will feature speakers from leading semiconductor companies, IP providers, foundries and Synopsys. These technical experts will describe the best practices, tools and methodologies they're using to solve today's design challenges, as well as discuss the emerging trends and advanced technology that will enable the next 25 years of semiconductor innovation.

Synopsys DAC Events, Monday, June 4, 2012:

AMS Verification Luncheon: Boost Productivity Using Synopsys' AMS Verification Solution

11:30 a.m. - 1:30 p.m., Marriott Hotel, Golden Gate Ballroom, Salon B

Industry leaders from AMD, ARM, GLOBALFOUNDRIES, Micron and NVIDIA share experiences using Synopsys' AMS verification solutions in some of today's most challenging designs.

IC Compiler Luncheon: Leading the Way to 20nm Design with Synopsys' IC Compiler™ Software

11:30 a.m. - 1:30 p.m., Marriott Hotel, Golden Gate Ballroom, Salon A

Hear from experts in foundry, processor, wireless and consumer electronics companies, such as STMicroelectronics, GLOBALFOUNDRIES and Samsung, that have successfully met the 20nm design enablement challenge with IC Compiler.

Customer Insight Sessions: High-Performance, Gigahertz+ Success with Synopsys' Galaxy™ Implementation Platform

2:00 p.m. with Samsung and 3:00 p.m. with NVIDIA, Moscone Convention Center East Mezzanine, Room 220

Technical experts will discuss the latest high-performance design trends, challenges and solutions. They'll share best practices and innovations in high-performance technology that help address Gigascale, Gigahertz+, low power and advanced geometry design challenges.

Synopsys' PrimeTime® Software Special Interest Group 2012 Dinner: Next-generation Hierarchical Timing Technology -- HyperScale

6:00 p.m. - 8:30 p.m., Marriott Hotel, Golden Gate Balzlroom, Salon A

At this event, you will see Synopsys' R&D team unveil the new underlying engines for its hierarchical timing technology, HyperScale. Industry experts will also share their experience with this innovative new technology, which demonstrated up to 10X faster and smaller full-chip timing analysis runs with signoff quality results matching flat analysis. Speakers include timing experts from LSI, NVIDIA, Samsung and Synopsys. The event will be moderated by Brian Bailey of EE Times. PrimeTime Ecosystem Partners will also be there, including ARM, Chip Estimate, eSilicon, Global UniChip Corp., Library Technologies, Nangate, Open-Silicon, Platform Computing, an IBM company, Runtime Design Automation, Samsung, SmartPlay, SpringSoft, Target Compiler Technologies, Univa and Z Circuit.

Synopsys DAC Events, Tuesday, June 5, 2012:

ARM, GLOBALFOUNDRIES, Samsung, Synopsys Partner Breakfast: Breaking through Barriers -- High-Performance and Energy-Efficient ARM Powered SoCs at 32/28nm and 20nm

7:15 - 8:45 a.m., Marriott Hotel, Golden Gate Ballroom, Salon A

In this session, experts from ARM, GLOBALFOUNDRIES, Samsung and Synopsys will describe key design and manufacturing challenges facing designers at 32/28nm and 20nm and how through collaboration, the companies are addressing these challenges. The collaboration combines semiconductor manufacturing, EDA and IP enablement, shared cycles of learning and silicon proof-points to enable a complete silicon-proven design enablement and manufacturing-ready solution for optimized implementations of ARM Powered high-performance and energy-efficient SoCs.

Customer Insight Sessions: High-Performance, Gigahertz+ Success with Synopsys' Galaxy™ Implementation Platform

10:00 a.m. with Cavium and 2:00 p.m. with Samsung, Moscone Convention Center East Mezzanine, Room 220

Technical experts will discuss the latest high-performance design trends, challenges and solutions. They'll share best practices and innovations in high-performance technology that help address Gigascale, Gigahertz+, low power and advanced geometry design challenges.

Verification Luncheon: SoC Leaders Verify with Synopsys

11:45 a.m. - 1:45 p.m., Marriott Hotel, Golden Gate Ballroom, Salon A

Given the complexity of today's SoC designs, incremental tool improvements will not be sufficient to deliver the required order-of-magnitude boost to verification productivity. At this luncheon, AMD, Broadcom, Cavium, Freescale, Qualcomm and ST-Ericsson will share their views on what's driving SoC complexity and how their teams have achieved success. They'll also discuss the latest developments in verification. The event will be moderated by John Chilton, senior vice president of marketing and strategic development at Synopsys.

IPL Alliance Luncheon: Reaping the Benefits of iPDKs

12:00 p.m. - 1:30 p.m., Marriott Hotel, Golden Gate Ballroom, Salon B

At the 6th Annual IPL Luncheon, presenters from multiple foundries will highlight the benefits of the Interoperable PDK (iPDK) standard and their experiences in developing and deploying foundry iPDKs. The IPL Alliance will also present an update on current and future IPL projects.

Customer Insight Session: Mixed-Signal SoC Design Success with the IC Compiler Custom Co-Design Solution

4:00 p.m. with STMicroelectronics and Proteus Biomedical, Moscone Convention Center East Mezzanine, Room 220

Attend an informative session on Synopsys' mixed-signal SoC implementation solution and custom co-design methodology advancements. Learn how leading companies have successfully tackled difficult "big D/little A" mixed-signal physical design challenges using Synopsys' unified cell-based and custom implementation solution with IC Compiler.

Synopsys at DAC 2012
In addition to special events, Synopsys will offer informative presentations and demonstrations of its comprehensive portfolio of integrated system-level, implementation, verification, IP, manufacturing and FPGA solutions. Visit Synopsys at Booth #1130 to learn about the newest solutions available to help enable the next 25 years of innovation. For more information on these special events and all Synopsys' activities at DAC visit www.synopsys.com/DAC.

Media Registration Information
Seating is limited at Synopsys' special events at DAC. Registration is required. Members of the media interested in attending Synopsys' special events or requiring more information should email inquiries to Diane Hayward at dhayward@mcapr.com.

About Synopsys
Synopsys, Inc. (Nasdaq:SNPS) is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. Synopsys' comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, software-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has more than 70 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at http://www.synopsys.com/.

Editorial Contacts:

Monica Marmie
Synopsys, Inc.
650-584-2890
monical@synopsys.com

Diane Hayward
MCA, Inc.
650-968-8900 ext. 117
dhayward@mcapr.com

SOURCE Synopsys, Inc.

NVIDIA Icera Modem Chipset Validated on AT&T LTE Network

Thu, 24 May 2012 13:00:00 +0000

NVIDIA today announced that the NVIDIA® Icera® 410 LTE multimode data modem chipset for tablets and clamshell devices has been tested and validated for operation on the AT&T 4G LTE network.

AT&T qualification tests help ensure that product manufacturers can confidently select chipsets that integrate with connected devices and can quickly achieve final product qualification.

"Validation with AT&T is an achievement that paves the way for NVIDIA Icera-powered LTE devices on the AT&T network through this year and next," said Stan Boland, senior vice president of Mobile Communications at NVIDIA.

The NVIDIA Icera 410 LTE modem delivers lightning-fast web browsing, video streaming and multiplayer gaming to tablets and clamshell devices. It is the first Icera modem to implement 4G LTE in NVIDIA's software defined radio baseband processor. Together with its multimode radio transceiver, the chipset offers 4G LTE at category 2 data rates (up to 50 Mbps) as well as 4G HSPA+, 3G and 2G compatibility.

Useful Links:
http://www.nvidia.com/tegra
http://www.nvidia.com/object/tegra-superchip.html
http://www.nvidia.com/object/nvidia-icera-products.html

About NVIDIA
NVIDIA (NASDAQ: NVDA) awakened the world to computer graphics when it invented the GPU in 1999. Today, its processors power a broad range of products from smartphones to supercomputers. NVIDIA's mobile processors are used in cell phones, tablets and auto infotainment systems. PC gamers rely on GPUs to enjoy spectacularly immersive worlds. Professionals use them to create 3D graphics and visual effects in movies and to design everything from golf clubs to jumbo jets. And researchers utilize GPUs to advance the frontiers of science with high performance computing. The company has more than 5,000 patents issued, allowed or filed, including ones covering ideas essential to modern computing. For more information, see www.nvidia.com.

Certain statements in this press release including, but not limited to statements as to: the availability, impact and benefits of the NVIDIA Icera 410 LTE multimode data modem chipset; and the effects of the company's patents on modern computing are forward-looking statements that are subject to risks and uncertainties that could cause results to be materially different than expectations. Important factors that could cause actual results to differ materially include: global economic conditions; our reliance on third parties to manufacture, assemble, package and test our products; the impact of technological development and competition; development of new products and technologies or enhancements to our existing product and technologies; market acceptance of our products or our partners products; design, manufacturing or software defects; changes in consumer preferences or demands; changes in industry standards and interfaces; unexpected loss of performance of our products or technologies when integrated into systems; as well as other factors detailed from time to time in the reports NVIDIA files with the Securities and Exchange Commission, or SEC, including its Form 10-Q for the fiscal period ended April 29, 2012. Copies of reports filed with the SEC are posted on the company's website and are available from NVIDIA without charge. These forward-looking statements are not guarantees of future performance and speak only as of the date hereof, and, except as required by law, NVIDIA disclaims any obligation to update these forward-looking statements to reflect future events or circumstances.

© 2012 NVIDIA Corporation. All rights reserved. NVIDIA, the NVIDIA logo, Icera and Tegra are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated. Features, pricing, availability, and specifications are subject to change without notice.

Synopsys Honors Accellera Systems Initiative with 2012 Tenzing Norgay Interoperability Achievement Award

Thu, 24 May 2012 13:00:00 +0000

Synopsys Honors Accellera Systems Initiative with 2012 Tenzing Norgay Interoperability Achievement Award

Open SystemC Initiative and Accellera merger paves way for broad interoperability standards

PR Newswire

MOUNTAIN VIEW, Calif., May 24, 2012 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, announced that Accellera Systems Initiative will receive Synopsys' twelfth annual Tenzing Norgay Interoperability Achievement Award for advancing industry standards that enable interoperable system design flows.

The Accellera Systems Initiative was formed in December 2011 through the merger of Open SystemC Initiative (OSCI) and Accellera. Since 2000, the two organizations have developed standards that are widely used in the semiconductor industry; Accellera developed SystemVerilog, Unified Power Format (UPF) and IP-XACT; and OSCI developed SystemC and TLM-2.0. These standards are underlying formats that enable interoperability among design and verification tools, allowing engineers to go from system level design to final signoff. With large overlap in their membership and the need to collaborate to enhance current standards for increasing complexity of future designs, the two organizations merged in 2011.

"We are honored to accept the Tenzing Norgay Interoperability Achievement Award," said Dr. Shishpal Rawat, Accellera Systems Initiative chair. "We continue to strive for developing standards that enable interoperability across the entire design flow. The new organization will offer uniform policies and procedures leading to operational efficiencies in developing and promoting EDA and IP standards across the entire design and verification flow."

In recent years, the user community has sought solutions that demanded greater interaction between OSCI and Accellera standards, namely SystemC and SystemVerilog respectively. With significant similarities in the two organizations' membership and in their goals of taking standards through IEEE for broader adoption around the world, it became clear that the combined organization could serve the user community more efficiently. As a result, all of the standards development effort will be done in technical sub-committees governed by one set of policies and procedures, and following a uniform IP Rights policy. The streamlined development process will provide for better standards, which will enable interoperable tools and comprehensive methodologies for system and system-on-chip (SoC) designers.

"OSCI and Accellera have played important roles in developing open, inclusive standards for system and SoC designers," said Rich Goldman, vice president of corporate marketing and strategic market development at Synopsys. "We applaud their merger to broaden the member collaboration under one single organizational umbrella."

About the Tenzing Norgay Interoperability Achievement Award
The Tenzing Norgay Interoperability Achievement Award was established by Synopsys to recognize EDA providers who collaborate on interoperable design flows that benefit the user community. The award is presented annually to organizations that have surpassed common levels of interoperability, have contributed to overall industry advancement and have helped provide a new view of the future for EDA interoperability. Named for the crucial role that Sherpa Tenzing Norgay played in the first successful attempt to reach the summit of Mount Everest in 1953, the Interoperability Achievement Award recognizes achievements that are critical to a designer's success.

About Accellera Systems Initiative
Accellera Systems Initiative is an independent, not-for-profit organization dedicated to create, support, promote and advance system-level design, modeling and verification standards for use by the worldwide electronics industry. The organization accelerates standards development, and as part of its ongoing partnership with the IEEE, its standards are contributed to the IEEE Standards Association for formal standardization and ongoing change control. For more information, please visit www.accellera.org. For membership information, please email membership@accellera.org.

About Synopsys
Synopsys, Inc. (Nasdaq:SNPS) is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. Synopsys' comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, system-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has approximately 70 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at http://www.synopsys.com/.

Editorial Contacts:

Monica Marmie
Synopsys, Inc.
650-584-4547
monical@synopsys.com

Deanna Doyon
MCA, Inc.
650-968-8900 ext. 203
ddoyon@mcapr.com

SOURCE Synopsys, Inc.

Emulex Celebrates the 'Art of Convergence' with California State University, Fullerton, Student Sculpture Competition

Thu, 24 May 2012 13:00:00 +0000

Emulex Celebrates the 'Art of Convergence' with California State University, Fullerton, Student Sculpture Competition

Winning Student Entries Selected at Orange County Gala Event

PR Newswire

COSTA MESA, Calif., May 24, 2012 /PRNewswire/ -- Emulex Corporation (NYSE:ELX), announced the winners of its 'Art of Convergence' competition Tuesday evening at a gala event held at the Center Club in Costa Mesa, CA. The sculpture-based art competition gave students of California State University, Fullerton (CSUF), the opportunity to design a work of art using recycled IT equipment to illustrate the concept of 'convergence.' Emulex donated the parts and gave each student $500 to help construct their piece, which was also a major part of their art curriculum. 23 entries were received and Ryan Kidder, from Irvine, Calif., who graduated this month from CSUF with a Bachelor of Arts degree in advertising with a minor in art, was awarded the top prize of $5,000. The runner-up, Mark Upson, from Orange, Calif., a graduate student working on his Master of Fine Arts degree in sculpture, won $1,000. In addition, Emulex donated $5,000 to the CSUF College of the Arts.

(LOGO: http://photos.prnewswire.com/prnh/20120403/NE81278LOGO)

The event was attended by CSUF staff, students and administrators, Emulex executives, and local art critics. The 10 finalist sculptures were determined through online voting by Emulex's 997 employees, and the winners were selected by a panel of judges which included Dr. Joe Arnold, College of the Arts Dean at CSUF, Emulex President and COO Jeff Benck, Richard Chang, arts and entertainment writer for The Orange County Register, Emulex chairman Paul Folino, Emulex CEO Jim McCluney, Emulex CFO Mike Rockenbach, and Evan Senn, local artist, contributor to Artillery Magazine and arts writer for KCET in Los Angeles.

Emulex also used social networking to identify a 'People's Choice' award recipient, who was determined by voting on the company's 'Art of Convergence' page on Facebook. The 'People's Choice' award also went to Ryan Kidder who won the award and received an iPad.

Videos and photos of the sculptures are available on the 'Art of Convergence' website and the event's Facebook page. The 10 finalist pieces will be displayed in the lobbies of Emulex's offices worldwide.

"The 'Art of Convergence' project is a unique challenge that stretches our students' abilities because it goes beyond a simple classroom critique to include a competition, a public exhibition of their work, and even prize money," said Jim Jenkins, Professor of Art and Sculpture at CSUF. "It's great to have that kind of competitive spirit in the classroom, and encourages the students to take a more professional approach to their work, which will help them in the future."

"Our goal is to provide the finest education in the arts that we can, and that includes challenging students with opportunities to stretch their creative abilities to new levels," said Dr. Joseph Arnold, College of the Arts Dean at CSUF. "Emulex's 'Art of Convergence' program is a great example of a challenge that elevates our students' aspirations beyond the classroom in order to work on a specific theme that is tied directly to a real-world trend, and gives them the opportunity to display their work publicly."

"The 'Art of Convergence' program represents the root of what we are passionate about at Emulex – being involved in the community around us and fostering education in sciences, engineering, technology and the arts," said Jim McCluney, CEO, Emulex. "The students of today will become the engineers, technologists and innovators of the future, so we wanted to encourage the creative process with a program that challenges students and combines art and technology in a meaningful way."

To learn more about the 'Art of Convergence' competition, please visit: http://www.emulex.com/aoc

To learn more about Emulex, please visit: http://www.emulex.com

To learn more about CSUF, please visit: http://www.fullerton.edu

Read CEO Jim McCluney's blog: Celebrating The Art of Convergence and Community Involvement: http://www.emulex.com/blogs/jim/?p=572

Follow Emulex on Twitter: http://www.twitter.com/emulex

About Emulex

Emulex, the leader in converged networking solutions, provides enterprise-class connectivity for servers, networks and storage devices within the data center. The Company's product portfolio of Fibre Channel host bus adapters, 10Gb Ethernet network interface cards, Ethernet-based converged network adapters, controllers, embedded bridges and switches, and connectivity management software are proven, tested and trusted by the world's largest and most demanding IT environments. Emulex solutions are used and offered by the industry's leading server and storage OEMs including, Cisco, Dell, EMC, Fujitsu, Hitachi, Hitachi Data Systems, HP, Huawei, IBM, NEC, NetApp and Oracle. Emulex is headquartered in Costa Mesa, Calif., and has offices and research facilities in North America, Asia and Europe. More information about Emulex (NYSE:ELX) is available at www.Emulex.com.

Emulex Safe Harbor Statement

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: With the exception of historical information, the statements set forth above include forward-looking statements that involve risk and uncertainties. Emulex wishes to caution readers that a number of important factors could cause actual results to differ materially from those in the forward-looking statements. Those factors include among others, intellectual property claims, with or without merit, that could result in costly litigation, cause product shipment delays, require Emulex to indemnify customers, or require Emulex to enter into royalty or licensing agreements, which may or may not be available. Furthermore, Emulex have in the past obtained, and may be required in the future to obtain, licenses of technology owned by other parties. Emulex cannot be certain that the necessary licenses will be available or that they can be obtained on commercially reasonable terms. If Emulex were to fail to obtain such royalty or licensing agreements in a timely manner and on reasonable terms, Emulex's business, results of operations and financial condition could be materially adversely affected. Ongoing lawsuits, such as the action brought by Broadcom Corporation ("Broadcom"), present inherent risks, any of which could have a material adverse effect on Emulex's business, financial condition, or results of operations. Such potential risks include continuing expenses of litigation, risk of loss of patent rights and/or monetary damages, risk of injunction against the sale of products incorporating the technology in question, counterclaims, attorneys' fees, incremental costs associated with product or component redesigns, and diversion of management's attention from other business matters. With respect to the Broadcom litigation such potential risks also include the availability of an adequate sunset period of time to make design changes, the ability to implement any design changes, the availability of customer resources to complete any re-qualification or re-testing that may be needed, the ability to maintain favorable working relationships with Emulex suppliers of SerDes modules and the ability to obtain a settlement that does not put Emulex at a competitive disadvantage. In addition, the fact that the economy generally, and the technology and storage segments specifically, have been in a state of uncertainty makes it difficult to determine if past experience is a good guide to the future and makes it impossible to determine if markets will grow or shrink in the short term. The current economic downturn and the resulting disruptions in world credit and equity markets that are creating economic uncertainty for Emulex's customers and the storage networking market as a whole has and could continue to adversely affect Emulex's revenues and results of operations. Furthermore, the effect of any actual or potential unsolicited offers to acquire Emulex may have an adverse effect on Emulex's operations. As a result of these uncertainties, Emulex is unable to predict its future results with any accuracy. Other factors affecting these forward-looking statements include, but are not limited to, the following: faster than anticipated decline in the storage networking market; slower than expected growth of the storage networking market or the failure of Emulex's Original Equipment Manufacturer ("OEM") customers to successfully incorporate Emulex products into their systems; Emulex's dependence on a limited number of customers and the effects of the loss of, decrease in or delays of orders by any such customers, or the failure of such customers to make timely payments; the emergence of new or stronger competitors as a result of consolidation movements in the market; the timing and market acceptance of Emulex products or Emulex OEM customers' new or enhanced products; costs associated with entry into new areas of the storage technology market; the variability in the level of Emulex's backlog and the variable and seasonal procurement patterns of Emulex's customers; any inadequacy of Emulex's intellectual property protection and the costs of actual or potential third-party claims of infringement and any related indemnity obligations or adverse judgments; impairment charges, including but not limited to goodwill and intangible assets; changes in tax rates or legislation; the effects of acquisitions; the effects of terrorist activities; natural disasters, such as the earthquake and resulting tsunami off the coast of Japan in March 2011 and the significant flooding in various parts of Thailand in October 2011, and any resulting disruption in Emulex's supply chain or customer purchasing patterns or any other resulting economic or political instability; the highly competitive nature of the markets for Emulex products as well as pricing pressures that may result from such competitive conditions; the effects of changes in Emulex's business model to separately charge for software; the effect of rapid migration of customers towards newer, lower cost product platforms; possible transitions from board or box level to application specific integrated circuit ("ASIC") solutions for selected applications; a shift in unit product mix from higher-end to lower-end or mezzanine card products; a faster than anticipated decrease in the average unit selling prices or an increase in the manufactured cost of Emulex products; delays in product development; Emulex's reliance on third-party suppliers and subcontractors for components and assembly; Emulex's ability to attract and retain key technical personnel; Emulex's ability to benefit from research and development activities; Emulex's dependence on international sales and internationally produced products; changes in accounting standards; and the potential effects of global warming and any resulting regulatory changes on Emulex's business. These and other factors that could cause actual results to differ materially from those in the forward-looking statements are also discussed in Emulex's filings with the Securities and Exchange Commission, including its recent filings on Forms 8-K, 10-K and 10-Q. Statements in this release are based on current expectations and, except as required by law, Emulex undertakes no obligation to revise or update any forward-looking statements for any reason. All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies.

Press Contacts:

Katherine Lane

Director, Corporate Communications

+1 714-885-3828

katherine.lane@emulex.com

Jolene Bonina

Public Relations Manager

+1 714-885-3858

jolene.bonina@emulex.com

SOURCE Emulex Corporation